Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives
- Author
- CHUNYAN YIN1 ; HUA LU1 ; BAILEY, Chris1 ; CHAN, Yan-Cheong2
[1] School of Computing and Mathematical Sciences, The University of Greenwich, London, SE10 9LS, United Kingdom
[2] Department of Electronic Engineering, City University of Hong Kong, Hong-Kong - Conference title
- Special Section of the Asian Green Electronics Conference (AGEC)
- Conference name
- International IEEE Conference on Asian Green Electronics (1 ; Hong Kong, Shenzhen 2004-01-05)
- Author (monograph)
- LIU, Johan (Editor)1 ; GRIESE, Hans Jorgen (Editor)2 ; CHAN, Yan-Cheong (Editor)2
Institute of Electrical and Electronics Engineers, Inc. (IEEE), New York, NY, United States (Funder/Sponsor)
[1] Chalmers University of Technology, Sweden
[2] IZM, Germany - Source
IEEE transactions on electronics packaging manufacturing. 2004, Vol 27, Num 4, pp 254-259, 6 p ; ref : 10 ref
- CODEN
- ITEPFL
- ISSN
- 1521-334X
- Scientific domain
- Electronics
- Publisher
- Institute of Electrical and Electronics Engineers, New York, NY
- Publication country
- United States
- Document type
- Conference Paper
- Language
- English
- Keyword (fr)
- Assemblage circuit intégré Brasage avec refusion Circuit intégré Connexion par billes Dilatation thermique Distribution contrainte Désadaptation Endommagement Fiabilité Interconnexion Modèle 3 dimensions Méthode numérique Méthode élément fini Polymère Puce à bosses Résistance contact Simulation ordinateur
- Keyword (en)
- Integrated circuit bonding Reflow soldering Integrated circuit Flip chip bonding Thermal expansion Stress distribution Mismatching Damaging Reliability Interconnection Three dimensional model Numerical method Finite element method Polymer Flip-chip Contact resistance Computer simulation
- Keyword (es)
- Soldeo con refusión Circuito integrado Conexión espesada Dilatación térmica Campo restricción Desadaptación Deterioración Fiabilidad Interconexión Modelo 3 dimensiones Método numérico Método elemento finito Polímero Resistencia contacto Simulación computadora
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06A Design. Technologies. Operation analysis. Testing
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 16531130
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1109/TEPM.2004.843152 
https://dx.doi.org/10.1109/TEPM.2004.843152
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