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Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives

Author
CHUNYAN YIN1 ; HUA LU1 ; BAILEY, Chris1 ; CHAN, Yan-Cheong2
[1] School of Computing and Mathematical Sciences, The University of Greenwich, London, SE10 9LS, United Kingdom
[2] Department of Electronic Engineering, City University of Hong Kong, Hong-Kong
Conference title
Special Section of the Asian Green Electronics Conference (AGEC)
Conference name
International IEEE Conference on Asian Green Electronics (1 ; Hong Kong, Shenzhen 2004-01-05)
Author (monograph)
LIU, Johan (Editor)1 ; GRIESE, Hans Jorgen (Editor)2 ; CHAN, Yan-Cheong (Editor)2
Institute of Electrical and Electronics Engineers, Inc. (IEEE), New York, NY, United States (Funder/Sponsor)
[1] Chalmers University of Technology, Sweden
[2] IZM, Germany
Source

IEEE transactions on electronics packaging manufacturing. 2004, Vol 27, Num 4, pp 254-259, 6 p ; ref : 10 ref

CODEN
ITEPFL
ISSN
1521-334X
Scientific domain
Electronics
Publisher
Institute of Electrical and Electronics Engineers, New York, NY
Publication country
United States
Document type
Conference Paper
Language
English
Keyword (fr)
Assemblage circuit intégré Brasage avec refusion Circuit intégré Connexion par billes Dilatation thermique Distribution contrainte Désadaptation Endommagement Fiabilité Interconnexion Modèle 3 dimensions Méthode numérique Méthode élément fini Polymère Puce à bosses Résistance contact Simulation ordinateur
Keyword (en)
Integrated circuit bonding Reflow soldering Integrated circuit Flip chip bonding Thermal expansion Stress distribution Mismatching Damaging Reliability Interconnection Three dimensional model Numerical method Finite element method Polymer Flip-chip Contact resistance Computer simulation
Keyword (es)
Soldeo con refusión Circuito integrado Conexión espesada Dilatación térmica Campo restricción Desadaptación Deterioración Fiabilidad Interconexión Modelo 3 dimensiones Método numérico Método elemento finito Polímero Resistencia contacto Simulación computadora
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06A Design. Technologies. Operation analysis. Testing

Discipline
Electronics
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
16531130

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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