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High-density 3-D microsystem-in-package technology and its application for integrated CCD micro-camera visual inspection system

Author
YAMADA, Hiroshi1 ; TOGASAKI, Takashi2 ; SADAMOTO, Atsushi1 ; SUDO, Hajime1
[1] Corporate Research & Development Center, Toshiba Corporation, 1, Komukai Toshiba-cho, Saiwai-ku, Kawasaki, Kanagawa 212-8582, Japan
[2] Corporate Manufacturing Engineering Center, Toshiba Corporation 33, Shin-isogo-cho, Isogo-ku, Yokohama, Kanagawa 235-0017, Japan
Conference title
Dielectrics for nanosystems : materials science, processing, reliability, and manufacturing (Honolulu HI, 3-8 October 2004)
Conference name
Dielectrics for nanosystems : materials science, processing, reliability, and manufacturing. International symposium (1 ; Honolulu HI 2004-10-03)
Author (monograph)
Singh, R (Editor); Iwai, H (Editor); Tummala, R.R (Editor); Sun, S.C (Editor)
Electrochemical Society, Dielectric Science Division, Pennington NJ, United States (Organiser of meeting)
Electrochemical Society, Technology Division, Pennington NJ, United States (Organiser of meeting)
Electrochemical Society, Electronics Division, Pennington NJ, United States (Organiser of meeting)
Source

Proceedings - Electrochemical Society. 2004, pp 277-291, 15 p ; ref : 32 ref

ISSN
0161-6374
ISBN
1-56677-417-9
Scientific domain
General chemistry, physical chemistry; Electronics; Electrical engineering; Energy; Physics
Publisher
Electrochemical Society, Pennington NJ
Publication country
United States
Document type
Conference Paper
Language
English
Keyword (fr)
Caméra CCD Circuit intégré Composant optique Contrôle visuel Densité élevée Dispositif CCD Dispositif électromécanique Imagerie CCD Interconnexion Micromachine Packaging électronique Transmission donnée
Keyword (en)
CCD camera Integrated circuit Optical component Visual control High density Charge coupled device Electromechanical device CCD imaging Interconnection Micromachine Electronic packaging Data transmission
Keyword (es)
Cámara CCD Circuito integrado Componente óptico Control visual Densidad elevada Dispositivo carga acoplada Dispositivo electromecánico Imagenería CCD Interconexión Micromáquina Packaging electrónico Transmisión datos
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06A Design. Technologies. Operation analysis. Testing

Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F07 Charge transfer devices

Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F16 Imaging devices

Discipline
Electronics
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
16545661

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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