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Protection of aluminum alloys from filiform corrosion by low-temperature plasma interface engineering

Author
YU, Q. S1 ; YASUDA, H. K1
[1] Center for Surface Science and Plasma Technology, Department of Chemical Engineering, University of Missouri-Columbia, Columbia, MO 65211, United States
Source

Progress in organic coatings. 2005, Vol 52, Num 3, pp 217-226, 10 p ; ref : 20 ref

ISSN
0300-9440
Scientific domain
Polymers, paint and wood industries
Publisher
Elsevier Sequoia, Lausanne
Publication country
Switzerland
Document type
Article
Language
English
Keyword (fr)
Adhérence Alliage base aluminium Amorce Corrosion filiforme Etude expérimentale Interface Nettoyage Propriété surface Protection corrosion Revêtement Traitement par plasma
Keyword (en)
Adhesion Aluminium base alloys Primer Filiform corrosion Experimental study Interface Cleaning Surface properties Corrosion protection Coatings Plasma assisted processing
Keyword (es)
Adherencia Iniciador Corrosión filiforme Estudio experimental Interfase Limpieza Propiedad superficie Protección corrosión Revestimiento
Keyword (de)
Adhaesion Fadenkorrosion Experimentelle Untersuchung Grenzflaeche Oberflaecheneigenschaft Korrosionsschutz Ueberzug
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D10 Polymer industry, paints, wood / 001D10B Coatings. Paints, varnishes and inks / 001D10B04 Film formation and curing, properties, testing

Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D11 Metals. Metallurgy / 001D11E Corrosion / 001D11E01 Corrosion mechanisms

Discipline
Metals. Metallurgy Polymer industry, paints, wood
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
16627528

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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