Non-isothermal preform infiltration during the vacuum-assisted resin transfer molding (VARTM) process
- Author
- GMJICIC, M1 ; CHITTAJALLU, K. M1 ; WALSH, Shawn2
[1] Department of Mechanical Engineering, Clemson University, 241 Fluor Daniel, Clemson, SC 29634-0921, United States
[2] Army Research Laboratory-WMRD AMSRL-WM-MD, Aberdeen, Proving Ground, MD 21005-5069, United States - Source
Applied surface science. 2005, Vol 245, Num 1-4, pp 51-64, 14 p ; ref : 15 ref
- Publisher
- Elsevier Science, Amsterdam
- Publication country
- Netherlands
- Document type
- Article
- Language
- English
- Author keyword
- 61.41.+e (Polymers) Vacuum-assisted resin transfer molding (VARTM) process Modeling and simulations
- Keyword (fr)
- Condition non isotherme Ebauche Epoxyde résine Infiltration Modélisation Moulage transfert Méthode élément fini
- Keyword (en)
- Non isothermal condition Preform Epoxy resin Infiltration Modelling Transfer molding Finite element method
- Keyword (es)
- Condición no isoterma Esbozo Epóxido resina Moldeo por transferencia
- Classification
- Pascal
- 001 Exact sciences and technology / 001B Physics / 001B60 Condensed matter: structure, mechanical and thermal properties / 001B60A Structure of solids and liquids; crystallography / 001B60A41 Polymers, elastomers, and plastics
- Pascal
- 001 Exact sciences and technology / 001B Physics / 001B80 Cross-disciplinary physics: materials science; rheology / 001B80A Materials science / 001B80A20 Materials synthesis; materials processing
- Discipline
- Physics and materials science Physics of condensed state : structure, mechanical and thermal properties
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 16712983
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1016/j.apsusc.2004.09.123 
https://dx.doi.org/10.1016/j.apsusc.2004.09.123
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