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Novel interconnection method using electrically conductive paste with fusible filler

Author
KIM, Jong-Min1 ; YASUDA, Kiyokazu1 ; FUJIMOTO, Kozo1
[1] Department of Manufacturing Science, Graduate School of Engineering, Osaka University, Osaka 565-0871, Japan
Source

Journal of electronic materials. 2005, Vol 34, Num 5, pp 600-604, 5 p ; ref : 18 ref

CODEN
JECMA5
ISSN
0361-5235
Scientific domain
Crystallography; Electronics; Metallurgy, welding; Condensed state physics
Publisher
Institute of Electrical and Electronics Engineers, New York, NY
Publication country
United States
Document type
Article
Language
English
Keyword (fr)
Adhésif Analyse sonde électronique Bisphénol A Calorimétrie différentielle balayage Coalescence Etain alliage Etude expérimentale Indium alliage Interconnexion Liant Matière charge Microscopie optique Microscopie électronique balayage Morphologie Mouillage Polymère Réticulation Alliage InSn In Sn Substrat Cu Composé minéral Composé organique
Keyword (en)
Adhesive Electron probe analysis Bisphenol A Differential scanning calorimetry Coalescence Tin alloy Experimental study Indium alloy Interconnection Binders Filler Optical microscopy Scanning electron microscopy Morphology Wetting Polymer Crosslinking Inorganic compound Organic compounds
Keyword (es)
Adhesivo Bisfenol Análisis calorimétrico barrido exploración Coalescencia Estaño aleación Estudio experimental Indio aleación Interconexión Ligante Materia carga Microscopía óptica Microscopía electrónica barrido Morfología Remojo Polímero Reticulación Compuesto inorgánico Compuesto orgánico
Classification
Pascal
001 Exact sciences and technology / 001B Physics / 001B60 Condensed matter: structure, mechanical and thermal properties / 001B60H Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties) / 001B60H45 Solid-fluid interfaces / 001B60H45G Wetting

Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F17 Microelectronic fabrication (materials and surfaces technology)

Pacs
8540L Metallization, contacts, interconnects; device isolation

Discipline
Electronics Physics of condensed state : structure, mechanical and thermal properties
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
16851510

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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