Preparation and thermal properties of bismaleimide blends based on hydroxyphenyl maleimide
- Author
- RAO, B. S1 ; SIREESHA, R1 ; PASALA, A. R1
[1] Organic Coatings and Polymers Division, Indian Institute of Chemical Technology, Tarnaka, Hyderabad 500007, India - Source
Polymer international. 2005, Vol 54, Num 8, pp 1103-1109, 7 p ; ref : 34 ref
- ISSN
- 0959-8103
- Scientific domain
- Polymers, paint and wood industries
- Publisher
- Wiley, Chichester
- Publication country
- United Kingdom
- Document type
- Article
- Language
- English
- Author keyword
- bismaleimide blends epoxy resin thermal properties
- Keyword (fr)
- Bismaléimide résine Cinétique Durcissement(matière plastique) Epoxyde résine Etude expérimentale Mélange polymère Propriété dynamomécanique Propriété thermique Préparation Relation composition propriété Stabilité thermique Sulfone copolymère
- Keyword (en)
- Bismaleimide resin Kinetics Curing(plastics) Epoxy resin Experimental study Polymer blends Dynamic mechanical properties Thermal properties Preparation Property composition relationship Thermal stability Sulfone copolymer
- Keyword (es)
- Bismaleimida resina Cinética Endurecimiento(material plástico) Epóxido resina Estudio experimental Propiedad dinamomecánica Propiedad térmica Preparación Relación composición propiedad Estabilidad térmica Sulfona copolímero
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D10 Polymer industry, paints, wood / 001D10A Technology of polymers / 001D10A05 Properties and testing / 001D10A05B Chemical properties
- Discipline
- Polymer industry, paints, wood
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 16927339
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1002/pi.1808 
https://dx.doi.org/10.1002/pi.1808
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