Novel multilayering technique using folded flexible circuits
- Author
- JAIN, Jinesh1 ; SAMANT, Sanjiv S1
[1] Physics Division, Department of Radiation On cology, St. Jude Children's Research Hospital, Memphis, TN 38105-2794, United States - Source
IEEE transactions on electronics packaging manufacturing. 2005, Vol 28, Num 3, pp 259-264, 6 p ; ref : 21 ref
- CODEN
- ITEPFL
- ISSN
- 1521-334X
- Scientific domain
- Electronics
- Publisher
- Institute of Electrical and Electronics Engineers, New York, NY
- Publication country
- United States
- Document type
- Article
- Language
- English
- Author keyword
- Multilayer folding flexible circuit
- Keyword (fr)
- Circuit intégré Circuit multicouche Circuit à la demande Densité élevée Dissipation thermique Interconnexion Matériau composite Modèle 2 dimensions Modèle 3 dimensions Multicouche Technologie planaire Trou interconnexion
- Keyword (en)
- Integrated circuit Multilayered circuit Custom circuit High density Thermal dissipation Interconnection Composite material Two dimensional model Three dimensional model Multiple layer Planar technology Via hole
- Keyword (es)
- Circuito integrado Circuito multicapa Circuito integrato personalizado Densidad elevada Disipación térmica Interconexión Material compuesto Modelo 2 dimensiones Modelo 3 dimensiones Capa múltiple Tecnología planar Agujero interconexión
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06A Design. Technologies. Operation analysis. Testing
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 17125497
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1109/TEPM.2005.853407 
https://dx.doi.org/10.1109/TEPM.2005.853407
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