Interfacial reaction and shear strength of Sn-0.7Cu solder/electrolytic Ni joints with reflow time
- Author
- YOON, Jeong-Won1 ; JUNG, Seung-Boo1
[1] Department of Advanced Materials Engineering, Sungkyunkwan University, Suwon, Korea, Republic of - Source
Zeitschrift für Metallkunde. = Materials research and advanced techniques. 2005, Vol 96, Num 12, pp 1420-1425, 6 p ; ref : 15 ref
- CODEN
- ZEMTAE
- ISSN
- 0044-3093
- Scientific domain
- Metallurgy, welding; Condensed state physics
- Publisher
- Hanser, München
- Publication country
- Germany
- Document type
- Article
- Language
- English
- Author keyword
- Ball-grid array Intermetallic compound Pb-free solder Shear test Sn-Cu solder
- Keyword (fr)
- Alliage base étain Assemblage brasage tendre Brasage tendre Cisaillement Composé intermétallique Essai cisaillement Interface Produit apport brasage tendre Réaction interface Résistance cisaillement Résistance mécanique
- Keyword (en)
- Tin base alloys Soldered joint Soldering Shear Intermetallic compound Shear test Interface Solder Interface reaction Shear strength Strength
- Keyword (es)
- Junta soldada Soldeo blando Cizalladura Compuesto intermetálico Ensayo cortante Interfase Producto aportación soldadura blanda Reacción interfase Resistencia cizallamiento Resistencia mecánica
- Keyword (de)
- Weichloetverbindung Weichloeten Scherung Intermetallische Verbindung Scherpruefung Grenzflaeche Weichlot Scherfestigkeit Festigkeit
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D11 Metals. Metallurgy / 001D11A General
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D11 Metals. Metallurgy / 001D11D Joining, thermal cutting: metallurgical aspects / 001D11D02 Brazing. Soldering
- Discipline
- Metals. Metallurgy
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 17364506
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.3139/146.101194 
https://dx.doi.org/10.3139/146.101194
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