Intermetallic compound formation and morphology evolution in the 95Pb5Sn flip-chip solder joint with Ti/Cu/Ni under bump metallization during reflow soldering
- Author
- WANG, Kai-Zheng1 ; CHEN, Chih-Ming1
[1] Department of Chemical Engineering, National Chung-Hsing University, Taichung 402, Taiwan, Province of China - Source
Journal of electronic materials. 2005, Vol 34, Num 12, pp 1543-1549, 7 p ; ref : 19 ref
- CODEN
- JECMA5
- ISSN
- 0361-5235
- Scientific domain
- Crystallography; Electronics; Metallurgy, welding; Condensed state physics
- Publisher
- Institute of Electrical and Electronics Engineers, New York, NY
- Publication country
- United States
- Document type
- Article
- Language
- English
- Author keyword
- Interfacial reaction Ti/Cu/Ni under bump metallization (UBM) high-lead 95Pb5Sn solder
- Keyword (fr)
- Alliage binaire Analyse sonde électronique Assemblage brasage tendre Brasage avec refusion Composé intermétallique Couche mince Diffusion Dépendance du temps Etain alliage Etude expérimentale Interface Microscopie électronique balayage Morphologie Mécanisme croissance Métallisation Orientation préférentielle Plomb alliage Puce à bosses Alliage PbSn Cu Métallisation sous secousse Ni Pb Sn Ti Composé minéral Métal transition
- Keyword (en)
- Binary alloy Electron probe analysis Soldered joint Reflow soldering Intermetallic compound Thin film Diffusion Time dependence Tin alloy Experimental study Interface Scanning electron microscopy Morphology Growth mechanism Metallizing Preferred orientation Lead alloy Flip-chip Under bump metallization Inorganic compound Transition metal
- Keyword (es)
- Aleación binaria Junta soldada Soldeo con refusión Compuesto intermetálico Capa fina Difusión Dependencia del tiempo Estaño aleación Estudio experimental Interfase Microscopía electrónica barrido Morfología Mecanismo crecimiento Metalización Orientación preferencial Plomo aleación Compuesto inorgánico Metal transición
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F17 Microelectronic fabrication (materials and surfaces technology)
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 17431972
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1007/s11664-005-0163-9 
https://dx.doi.org/10.1007/s11664-005-0163-9
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