Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads
- Author
- LIU, Yu-Chih1 ; LIN, Wei-Hong1 ; LIN, Hsiu-Jen1 ; CHUANG, Tung-Han1
[1] Institute of Materials Science and Engineering, National Taiwan University, Taipei 106, Taiwan, Province of China - Source
Journal of electronic materials. 2006, Vol 35, Num 1, pp 147-153, 7 p ; ref : 9 ref
- CODEN
- JECMA5
- ISSN
- 0361-5235
- Scientific domain
- Crystallography; Electronics; Metallurgy, welding; Condensed state physics
- Publisher
- Institute of Electrical and Electronics Engineers, New York, NY
- Publication country
- United States
- Document type
- Article
- Language
- English
- Author keyword
- Ag/Cu pad Au/Ni/Cu pad Sn-8Zn-20In solder ball shear strength intermetallic compounds
- Keyword (fr)
- Alliage ternaire Assemblage brasage tendre Calorimétrie différentielle balayage Composé intermétallique Etain alliage Etude expérimentale Fractographie Indium alliage Interface Liaison matériau Microstructure Morphologie Métallisation Or Résistance cisaillement Technologie BGA Vieillissement Zinc alliage Ag Alliage InSnZn Au Cu In Sn Zn Ni Composé minéral Métal transition alliage Métal transition
- Keyword (en)
- Ternary alloys Soldered joints Differential scanning calorimetry Intermetallic compounds Tin alloys Experimental study Fractography Indium alloys Interfaces Bonding Microstructure Morphology Metallizing Gold Shear strength Ball grid arrays Aging Zinc alloys Inorganic compounds Transition element alloys Transition elements
- Classification
- Pascal
- 001 Exact sciences and technology / 001B Physics / 001B60 Condensed matter: structure, mechanical and thermal properties / 001B60B Mechanical and acoustical properties of condensed matter / 001B60B20 Mechanical properties of solids / 001B60B20D Elasticity, elastic constants
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F17 Microelectronic fabrication (materials and surfaces technology)
- Discipline
- Electronics Physics of condensed state : structure, mechanical and thermal properties
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 17447113
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1007/s11664-006-0197-7 
https://dx.doi.org/10.1007/s11664-006-0197-7
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