Phase transformation of the phosphorus-rich layer in SnAgCu/Ni-P solder joints
- Author
- LIN, Yung-Chi1 ; DUH, Jenq-Gong1
[1] Department of Materials Science and Engineering, National Tsing Hua University, 101, Sec. 2, Kuang-Fu Road, 300 Hsinchu, Taiwan, Province of China - Source
Scripta materialia. 2006, Vol 54, Num 9, pp 1661-1665, 5 p ; ref : 19 ref
- ISSN
- 1359-6462
- Scientific domain
- Metallurgy, welding
- Publisher
- Elsevier Science, New York, NY
- Publication country
- United States
- Document type
- Article
- Language
- English
- Author keyword
- Intermetallic compounds Lead-free solder Phase transformations
- Keyword (fr)
- Assemblage brasage tendre Brasage tendre Composé intermétallique Produit apport brasage tendre Transformation phase
- Keyword (en)
- Soldered joint Soldering Intermetallic compound Solder Phase transformation
- Keyword (es)
- Junta soldada Soldeo blando Compuesto intermetálico Producto aportación soldadura blanda Transformación fase
- Keyword (de)
- Weichloetverbindung Weichloeten Intermetallische Verbindung Weichlot Phasenumwandlung
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D11 Metals. Metallurgy / 001D11A General
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D11 Metals. Metallurgy / 001D11D Joining, thermal cutting: metallurgical aspects / 001D11D02 Brazing. Soldering
- Discipline
- Metals. Metallurgy
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 17547996
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1016/j.scriptamat.2006.01.006 
https://dx.doi.org/10.1016/j.scriptamat.2006.01.006
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