Inlaying nanoscale surface recess patterns with nanoscale objects
- Author
- YAU, Siu-Tung1 ; NGEE MEI THAI1 ; STRAUSS, Ela1 ; RANA, Narender2 ; GANG WANG1
[1] Department of Physics and Astronomy, Hunter College of City University of New York, New York, NY 10021, United States
[2] College of Nanoscale Science and Engineering, The University at Albany State University of New York, Albany, NY 12203, United States - Source
Journal of nanoscience and nanotechnology (Print). 2006, Vol 6, Num 3, pp 796-801, 6 p
- ISSN
- 1533-4880
- Scientific domain
- Crystallography; Electronics; Nanotechnologies, nanostructures, nanoobjects
- Publisher
- American Scientific Publishers, Stevenson Ranch, CA
- Publication country
- United States
- Document type
- Article
- Language
- English
- Author keyword
- AFM Fabrication Nanoscale Assembly Nanoscale Electrochemistry Protein Patterning
- Keyword (fr)
- Echelle nanométrique Etat surface Formation motif Lithographie Microscopie force atomique Nanostructure Technologie faisceau ion focalisé Transfert électron Voltammétrie cyclique 8165
- Keyword (en)
- Nanometer scale Surface states Patterning Lithography Atomic force microscopy Nanostructures Focused ion beam technology Electron transfer Cyclic voltammetry
- Keyword (es)
- Voltametría cíclica
- Classification
- Pascal
- 001 Exact sciences and technology / 001B Physics / 001B80 Cross-disciplinary physics: materials science; rheology / 001B80A Materials science / 001B80A65 Surface treatments
- Discipline
- Physics and materials science
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 17575409
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1166/jnn.2006.105 
https://dx.doi.org/10.1166/jnn.2006.105
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