Silicon-based packaging platform for light-emitting diode
- Author
- TSOU, Chingfu1 ; HUANG, Yu-Sheng1
[1] Department of Automatic Control Engineering, Feng Chia University, Taichung 40724, Taiwan, Province of China - Source
IEEE transactions on advanced packaging. 2006, Vol 29, Num 3, pp 607-614, 8 p ; ref : 19 ref
- ISSN
- 1521-3323
- Scientific domain
- Electronics
- Publisher
- Institute of Electrical and Electronics Engineers, Piscataway, NY
- Publication country
- United States
- Document type
- Article
- Language
- English
- Author keyword
- Bulk micromachining light-emitting diode (LED) package silicon substrate thermal stress
- Keyword (fr)
- Assemblage brasage tendre Assemblage circuit intégré Brasage avec refusion Brillance Caractéristique optique Caractéristique thermique Circuit intégré Contrainte thermique Dilatation thermique Diode électroluminescente Dispositif optoélectronique Dispositif semiconducteur Désadaptation Détecteur image Evaluation performance Fabrication microélectronique Interconnexion Laser injection Logiciel Microusinage Packaging électronique Pastille électronique Résistance électrique 4255P
- Keyword (en)
- Soldered joint Integrated circuit bonding Reflow soldering Brightness Optical characteristic Thermal characteristic Integrated circuit Thermal stress Thermal expansion Light emitting diode Optoelectronic device Semiconductor device Mismatching Image sensor Performance evaluation Microelectronic fabrication Interconnection Injection laser Software Micromachining Electronic packaging Wafer Resistor
- Keyword (es)
- Junta soldada Soldeo con refusión Brillantez Característica óptica Característica térmica Circuito integrado Tensión térmica Dilatación térmica Diodo electroluminescente Dispositivo optoelectrónico Dispositivo semiconductor Desadaptación Detector imagen Evaluación prestación Fabricación microeléctrica Interconexión Laser inyección Logicial Micromaquinado Packaging electrónico Pastilla electrónica Resistencia eléctrica(componente)
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03D Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06A Design. Technologies. Operation analysis. Testing
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F15 Optoelectronic devices
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F17 Microelectronic fabrication (materials and surfaces technology)
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 18030666
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1109/TADVP.2006.875409 
https://dx.doi.org/10.1109/TADVP.2006.875409
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