Silicon micromachining of high aspect ratio, high-density through-wafer electrical interconnects for 3-D multichip packaging
- Author
- ZHEYAO WANG1 ; LIANWEI WANG2 ; NGUYEN, N. T3 ; WIEN, Wim A. H4 ; SCHELLEVIS, Hugo4 ; SARRO, Pasqualina M4 ; BURGHARTZ, Joachim N4
[1] Lab of Electronic Components, Technology, and Materials (ECTM), Delft Institute of Microelectronics and Submicron Technology (DIMES), Delft University of Technology, 2600 GB Delft, Netherlands
[2] Department of Electrical Engineering, East China Normal University, Shanghai 200062, China
[3] ITIMS, Hanoi University of Technology, Hanoi, Viet Nam
[4] ECTM/DIMES, Delft University of Technology, 2600 GB Delft, Netherlands - Source
IEEE transactions on advanced packaging. 2006, Vol 29, Num 3, pp 615-622, 8 p ; ref : 28 ref
- ISSN
- 1521-3323
- Scientific domain
- Electronics
- Publisher
- Institute of Electrical and Electronics Engineers, Piscataway, NY
- Publication country
- United States
- Document type
- Article
- Language
- English
- Author keyword
- Copper electroplating deep-reactive ion etching (DRIE) interconnect packaging tetra methyl ammonium hydroxide (TMAH) through-wafer
- Keyword (fr)
- Cavité dans réseau Circuit intégré Densité élevée Dépôt électrolytique Fabrication microélectronique Gravure ionique réactive Interconnexion Microusinage Module multipuce Modèle 3 dimensions Packaging électronique Pastille électronique Rapport aspect Résistance mécanique Surface arrière Trou interconnexion
- Keyword (en)
- Void Integrated circuit High density Electrodeposition Microelectronic fabrication Reactive ion etching Interconnection Micromachining Multichip module Three dimensional model Electronic packaging Wafer Aspect ratio Strength Back surface Via hole
- Keyword (es)
- Cavidad en red Circuito integrado Densidad elevada Depósito electrolítico Fabricación microeléctrica Grabado iónico reactivo Interconexión Micromaquinado Modulo multipulga Modelo 3 dimensiones Packaging electrónico Pastilla electrónica Relación dimensional Resistencia mecánica Superficie atrás Agujero interconexión
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06A Design. Technologies. Operation analysis. Testing
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F17 Microelectronic fabrication (materials and surfaces technology)
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 18030667
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
Access to the document
Install on your browser
DOI
10.1109/TADVP.2005.853552 
https://dx.doi.org/10.1109/TADVP.2005.853552
"O:13:\"PanistOpenUrl\":36:{s:10:\"\u0000*\u0000openUrl\";N;s:6:\"\u0000*\u0000idc\";N;s:6:\"\u0000*\u0000fmt\";s:7:\"journal\";s:6:\"\u0000*\u0000doi\";s:25:\"10.1109\/TADVP.2005.853552\";s:6:\"\u0000*\u0000pii\";s:0:\"\";s:7:\"\u0000*\u0000pmid\";s:0:\"\";s:9:\"\u0000*\u0000atitle\";s:124:\"Silicon micromachining of high aspect ratio, high-density through-wafer electrical interconnects for 3-D multichip packaging\";s:9:\"\u0000*\u0000jtitle\";s:39:\"IEEE transactions on advanced packaging\";s:9:\"\u0000*\u0000stitle\";s:23:\"IEEE trans. adv. packag\";s:7:\"\u0000*\u0000date\";s:4:\"2006\";s:9:\"\u0000*\u0000volume\";s:2:\"29\";s:8:\"\u0000*\u0000issue\";s:1:\"3\";s:8:\"\u0000*\u0000spage\";s:3:\"615\";s:8:\"\u0000*\u0000epage\";s:3:\"622\";s:8:\"\u0000*\u0000pages\";s:0:\"\";s:7:\"\u0000*\u0000issn\";s:9:\"1521-3323\";s:8:\"\u0000*\u0000eissn\";s:0:\"\";s:9:\"\u0000*\u0000aulast\";s:11:\"ZHEYAO WANG\";s:10:\"\u0000*\u0000aufirst\";s:0:\"\";s:9:\"\u0000*\u0000auinit\";s:0:\"\";s:10:\"\u0000*\u0000auinitm\";s:0:\"\";s:5:\"\u0000*\u0000au\";a:6:{i:0;s:12:\"LIANWEI WANG\";i:1;s:12:\"NGUYEN, N. T\";i:2;s:14:\"WIEN, Wim A. H\";i:3;s:16:\"SCHELLEVIS, Hugo\";i:4;s:19:\"SARRO, Pasqualina M\";i:5;s:20:\"BURGHARTZ, Joachim N\";}s:9:\"\u0000*\u0000aucorp\";s:0:\"\";s:7:\"\u0000*\u0000isbn\";s:0:\"\";s:8:\"\u0000*\u0000coden\";s:0:\"\";s:8:\"\u0000*\u0000genre\";s:7:\"article\";s:7:\"\u0000*\u0000part\";s:0:\"\";s:9:\"\u0000*\u0000btitle\";s:0:\"\";s:8:\"\u0000*\u0000title\";s:124:\"Silicon micromachining of high aspect ratio, high-density through-wafer electrical interconnects for 3-D multichip packaging\";s:8:\"\u0000*\u0000place\";s:14:\"Piscataway, NY\";s:6:\"\u0000*\u0000pub\";s:49:\"Institute of Electrical and Electronics Engineers\";s:10:\"\u0000*\u0000edition\";s:0:\"\";s:9:\"\u0000*\u0000tpages\";s:1:\"8\";s:9:\"\u0000*\u0000series\";s:0:\"\";s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";b:1;}"
Panist access
"O:12:\"IstexOpenUrl\":35:{s:10:\"\u0000*\u0000openUrl\";N;s:6:\"\u0000*\u0000fmt\";s:7:\"journal\";s:6:\"\u0000*\u0000doi\";s:25:\"10.1109\/TADVP.2005.853552\";s:6:\"\u0000*\u0000pii\";s:0:\"\";s:7:\"\u0000*\u0000pmid\";s:0:\"\";s:9:\"\u0000*\u0000atitle\";s:124:\"Silicon micromachining of high aspect ratio, high-density through-wafer electrical interconnects for 3-D multichip packaging\";s:9:\"\u0000*\u0000jtitle\";s:39:\"IEEE transactions on advanced packaging\";s:9:\"\u0000*\u0000stitle\";s:23:\"IEEE trans. adv. packag\";s:7:\"\u0000*\u0000date\";s:4:\"2006\";s:9:\"\u0000*\u0000volume\";s:2:\"29\";s:8:\"\u0000*\u0000issue\";s:1:\"3\";s:8:\"\u0000*\u0000spage\";s:3:\"615\";s:8:\"\u0000*\u0000epage\";s:3:\"622\";s:8:\"\u0000*\u0000pages\";s:0:\"\";s:7:\"\u0000*\u0000issn\";s:9:\"1521-3323\";s:8:\"\u0000*\u0000eissn\";s:0:\"\";s:9:\"\u0000*\u0000aulast\";s:11:\"ZHEYAO WANG\";s:10:\"\u0000*\u0000aufirst\";s:0:\"\";s:9:\"\u0000*\u0000auinit\";s:0:\"\";s:10:\"\u0000*\u0000auinitm\";s:0:\"\";s:5:\"\u0000*\u0000au\";a:6:{i:0;s:12:\"LIANWEI WANG\";i:1;s:12:\"NGUYEN, N. T\";i:2;s:14:\"WIEN, Wim A. H\";i:3;s:16:\"SCHELLEVIS, Hugo\";i:4;s:19:\"SARRO, Pasqualina M\";i:5;s:20:\"BURGHARTZ, Joachim N\";}s:9:\"\u0000*\u0000aucorp\";s:0:\"\";s:7:\"\u0000*\u0000isbn\";s:0:\"\";s:8:\"\u0000*\u0000coden\";s:0:\"\";s:8:\"\u0000*\u0000genre\";s:7:\"article\";s:7:\"\u0000*\u0000part\";s:0:\"\";s:9:\"\u0000*\u0000btitle\";s:0:\"\";s:8:\"\u0000*\u0000title\";s:124:\"Silicon micromachining of high aspect ratio, high-density through-wafer electrical interconnects for 3-D multichip packaging\";s:8:\"\u0000*\u0000place\";s:14:\"Piscataway, NY\";s:6:\"\u0000*\u0000pub\";s:49:\"Institute of Electrical and Electronics Engineers\";s:10:\"\u0000*\u0000edition\";s:0:\"\";s:9:\"\u0000*\u0000tpages\";s:1:\"8\";s:9:\"\u0000*\u0000series\";s:0:\"\";s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";b:1;}"
Istex access
"O:16:\"UnpaywallOpenUrl\":35:{s:8:\"\u0000*\u0000email\";s:27:\"assistance-portail@inist.fr\";s:6:\"\u0000*\u0000fmt\";N;s:6:\"\u0000*\u0000doi\";s:25:\"10.1109\/TADVP.2005.853552\";s:6:\"\u0000*\u0000pii\";N;s:7:\"\u0000*\u0000pmid\";N;s:9:\"\u0000*\u0000atitle\";N;s:9:\"\u0000*\u0000jtitle\";N;s:9:\"\u0000*\u0000stitle\";N;s:7:\"\u0000*\u0000date\";N;s:9:\"\u0000*\u0000volume\";N;s:8:\"\u0000*\u0000issue\";N;s:8:\"\u0000*\u0000spage\";N;s:8:\"\u0000*\u0000epage\";N;s:8:\"\u0000*\u0000pages\";N;s:7:\"\u0000*\u0000issn\";N;s:8:\"\u0000*\u0000eissn\";N;s:9:\"\u0000*\u0000aulast\";N;s:10:\"\u0000*\u0000aufirst\";N;s:9:\"\u0000*\u0000auinit\";N;s:10:\"\u0000*\u0000auinitm\";N;s:5:\"\u0000*\u0000au\";N;s:9:\"\u0000*\u0000aucorp\";N;s:7:\"\u0000*\u0000isbn\";N;s:8:\"\u0000*\u0000coden\";N;s:8:\"\u0000*\u0000genre\";N;s:7:\"\u0000*\u0000part\";N;s:9:\"\u0000*\u0000btitle\";N;s:8:\"\u0000*\u0000title\";N;s:8:\"\u0000*\u0000place\";N;s:6:\"\u0000*\u0000pub\";N;s:10:\"\u0000*\u0000edition\";N;s:9:\"\u0000*\u0000tpages\";N;s:9:\"\u0000*\u0000series\";N;s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";N;}"
Unpaywall access
"O:16:\"EuropePMCOpenUrl\":35:{s:10:\"\u0000*\u0000openUrl\";N;s:6:\"\u0000*\u0000fmt\";s:7:\"journal\";s:6:\"\u0000*\u0000doi\";s:25:\"10.1109\/TADVP.2005.853552\";s:6:\"\u0000*\u0000pii\";s:0:\"\";s:7:\"\u0000*\u0000pmid\";s:0:\"\";s:9:\"\u0000*\u0000atitle\";s:124:\"Silicon micromachining of high aspect ratio, high-density through-wafer electrical interconnects for 3-D multichip packaging\";s:9:\"\u0000*\u0000jtitle\";s:39:\"IEEE transactions on advanced packaging\";s:9:\"\u0000*\u0000stitle\";s:23:\"IEEE trans. adv. packag\";s:7:\"\u0000*\u0000date\";s:4:\"2006\";s:9:\"\u0000*\u0000volume\";s:2:\"29\";s:8:\"\u0000*\u0000issue\";s:1:\"3\";s:8:\"\u0000*\u0000spage\";s:3:\"615\";s:8:\"\u0000*\u0000epage\";s:3:\"622\";s:8:\"\u0000*\u0000pages\";s:0:\"\";s:7:\"\u0000*\u0000issn\";s:9:\"1521-3323\";s:8:\"\u0000*\u0000eissn\";s:0:\"\";s:9:\"\u0000*\u0000aulast\";s:11:\"ZHEYAO WANG\";s:10:\"\u0000*\u0000aufirst\";s:0:\"\";s:9:\"\u0000*\u0000auinit\";s:0:\"\";s:10:\"\u0000*\u0000auinitm\";s:0:\"\";s:5:\"\u0000*\u0000au\";a:6:{i:0;s:12:\"LIANWEI WANG\";i:1;s:12:\"NGUYEN, N. T\";i:2;s:14:\"WIEN, Wim A. H\";i:3;s:16:\"SCHELLEVIS, Hugo\";i:4;s:19:\"SARRO, Pasqualina M\";i:5;s:20:\"BURGHARTZ, Joachim N\";}s:9:\"\u0000*\u0000aucorp\";s:0:\"\";s:7:\"\u0000*\u0000isbn\";s:0:\"\";s:8:\"\u0000*\u0000coden\";s:0:\"\";s:8:\"\u0000*\u0000genre\";s:7:\"article\";s:7:\"\u0000*\u0000part\";s:0:\"\";s:9:\"\u0000*\u0000btitle\";s:0:\"\";s:8:\"\u0000*\u0000title\";s:124:\"Silicon micromachining of high aspect ratio, high-density through-wafer electrical interconnects for 3-D multichip packaging\";s:8:\"\u0000*\u0000place\";s:14:\"Piscataway, NY\";s:6:\"\u0000*\u0000pub\";s:49:\"Institute of Electrical and Electronics Engineers\";s:10:\"\u0000*\u0000edition\";s:0:\"\";s:9:\"\u0000*\u0000tpages\";s:1:\"8\";s:9:\"\u0000*\u0000series\";s:0:\"\";s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";b:1;}"
Europe PubMed Central access
"O:11:\"BaseOpenUrl\":35:{s:10:\"\u0000*\u0000openUrl\";N;s:6:\"\u0000*\u0000fmt\";s:7:\"journal\";s:6:\"\u0000*\u0000doi\";s:25:\"10.1109\/TADVP.2005.853552\";s:6:\"\u0000*\u0000pii\";s:0:\"\";s:7:\"\u0000*\u0000pmid\";s:0:\"\";s:9:\"\u0000*\u0000atitle\";s:124:\"Silicon micromachining of high aspect ratio, high-density through-wafer electrical interconnects for 3-D multichip packaging\";s:9:\"\u0000*\u0000jtitle\";s:39:\"IEEE transactions on advanced packaging\";s:9:\"\u0000*\u0000stitle\";s:23:\"IEEE trans. adv. packag\";s:7:\"\u0000*\u0000date\";s:4:\"2006\";s:9:\"\u0000*\u0000volume\";s:2:\"29\";s:8:\"\u0000*\u0000issue\";s:1:\"3\";s:8:\"\u0000*\u0000spage\";s:3:\"615\";s:8:\"\u0000*\u0000epage\";s:3:\"622\";s:8:\"\u0000*\u0000pages\";s:0:\"\";s:7:\"\u0000*\u0000issn\";s:9:\"1521-3323\";s:8:\"\u0000*\u0000eissn\";s:0:\"\";s:9:\"\u0000*\u0000aulast\";s:11:\"ZHEYAO WANG\";s:10:\"\u0000*\u0000aufirst\";s:0:\"\";s:9:\"\u0000*\u0000auinit\";s:0:\"\";s:10:\"\u0000*\u0000auinitm\";s:0:\"\";s:5:\"\u0000*\u0000au\";a:6:{i:0;s:12:\"LIANWEI WANG\";i:1;s:12:\"NGUYEN, N. T\";i:2;s:14:\"WIEN, Wim A. H\";i:3;s:16:\"SCHELLEVIS, Hugo\";i:4;s:19:\"SARRO, Pasqualina M\";i:5;s:20:\"BURGHARTZ, Joachim N\";}s:9:\"\u0000*\u0000aucorp\";s:0:\"\";s:7:\"\u0000*\u0000isbn\";s:0:\"\";s:8:\"\u0000*\u0000coden\";s:0:\"\";s:8:\"\u0000*\u0000genre\";s:7:\"article\";s:7:\"\u0000*\u0000part\";s:0:\"\";s:9:\"\u0000*\u0000btitle\";s:0:\"\";s:8:\"\u0000*\u0000title\";s:124:\"Silicon micromachining of high aspect ratio, high-density through-wafer electrical interconnects for 3-D multichip packaging\";s:8:\"\u0000*\u0000place\";s:14:\"Piscataway, NY\";s:6:\"\u0000*\u0000pub\";s:49:\"Institute of Electrical and Electronics Engineers\";s:10:\"\u0000*\u0000edition\";s:0:\"\";s:9:\"\u0000*\u0000tpages\";s:1:\"8\";s:9:\"\u0000*\u0000series\";s:0:\"\";s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";b:1;}"
Base Search access
"O:12:\"ArXivOpenUrl\":35:{s:10:\"\u0000*\u0000openUrl\";N;s:6:\"\u0000*\u0000fmt\";s:7:\"journal\";s:6:\"\u0000*\u0000doi\";s:25:\"10.1109\/TADVP.2005.853552\";s:6:\"\u0000*\u0000pii\";s:0:\"\";s:7:\"\u0000*\u0000pmid\";s:0:\"\";s:9:\"\u0000*\u0000atitle\";s:124:\"Silicon micromachining of high aspect ratio, high-density through-wafer electrical interconnects for 3-D multichip packaging\";s:9:\"\u0000*\u0000jtitle\";s:39:\"IEEE transactions on advanced packaging\";s:9:\"\u0000*\u0000stitle\";s:23:\"IEEE trans. adv. packag\";s:7:\"\u0000*\u0000date\";s:4:\"2006\";s:9:\"\u0000*\u0000volume\";s:2:\"29\";s:8:\"\u0000*\u0000issue\";s:1:\"3\";s:8:\"\u0000*\u0000spage\";s:3:\"615\";s:8:\"\u0000*\u0000epage\";s:3:\"622\";s:8:\"\u0000*\u0000pages\";s:0:\"\";s:7:\"\u0000*\u0000issn\";s:9:\"1521-3323\";s:8:\"\u0000*\u0000eissn\";s:0:\"\";s:9:\"\u0000*\u0000aulast\";s:11:\"ZHEYAO WANG\";s:10:\"\u0000*\u0000aufirst\";s:0:\"\";s:9:\"\u0000*\u0000auinit\";s:0:\"\";s:10:\"\u0000*\u0000auinitm\";s:0:\"\";s:5:\"\u0000*\u0000au\";a:6:{i:0;s:12:\"LIANWEI WANG\";i:1;s:12:\"NGUYEN, N. T\";i:2;s:14:\"WIEN, Wim A. H\";i:3;s:16:\"SCHELLEVIS, Hugo\";i:4;s:19:\"SARRO, Pasqualina M\";i:5;s:20:\"BURGHARTZ, Joachim N\";}s:9:\"\u0000*\u0000aucorp\";s:0:\"\";s:7:\"\u0000*\u0000isbn\";s:0:\"\";s:8:\"\u0000*\u0000coden\";s:0:\"\";s:8:\"\u0000*\u0000genre\";s:7:\"article\";s:7:\"\u0000*\u0000part\";s:0:\"\";s:9:\"\u0000*\u0000btitle\";s:0:\"\";s:8:\"\u0000*\u0000title\";s:124:\"Silicon micromachining of high aspect ratio, high-density through-wafer electrical interconnects for 3-D multichip packaging\";s:8:\"\u0000*\u0000place\";s:14:\"Piscataway, NY\";s:6:\"\u0000*\u0000pub\";s:49:\"Institute of Electrical and Electronics Engineers\";s:10:\"\u0000*\u0000edition\";s:0:\"\";s:9:\"\u0000*\u0000tpages\";s:1:\"8\";s:9:\"\u0000*\u0000series\";s:0:\"\";s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";b:1;}"
arXiv access
