3-D packaging : Where all technologies come together
- Author
- KARNEZOS, Marcos1
[1] ChipPAC Inc. 47400 Kato Rd, Fremont, CA 94538, United States - Conference title
- 29th international electronics manufacturing technology symposium (San Jose CA CA, 14-16 July 2004)
- Conference name
- IEEE/CPMT/SEMI international electronics manufacturing technology. Symposium (29 ; San Jose CA 2004)
- Author (monograph)
- Institute of Electrical and Electronics Engineers, United States (Organiser of meeting)
- Source
29th international electronics manufacturing technology symposium (San Jose CA CA, 14-16 July 2004). 2004 ; 1Vol, pp 64-67, 4 p ; ref : 1 ref
- ISBN
- 0-7803-8582-9
- Scientific domain
- Electronics
- Publisher
- IEEE, Piscataway NJ
- Publication country
- United States
- Document type
- Conference Paper
- Language
- English
- Keyword (fr)
- Assemblage circuit intégré Circuit intégré Couche mince Diminution coût Evaluation performance Fiabilité Flexibilité Interconnexion Matrice formage Packaging électronique Technologie CSP Microcâblage
- Keyword (en)
- Integrated circuit bonding Integrated circuit Thin film Cost lowering Performance evaluation Reliability Flexibility Interconnection Die Electronic packaging Chip scale packaging Wire bonding
- Keyword (es)
- Circuito integrado Capa fina Reducción costes Evaluación prestación Fiabilidad Flexibilidad Interconexión Matriz formadora Packaging electrónico Unión por hilo
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06A Design. Technologies. Operation analysis. Testing
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 18162544
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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