The development of a novel stacked package : Package in package
- Author
- CARSON, Flynn1 ; KIM, Young-Cheol1
[1] ChipPAC Incorporated 47400 Kato Road, Fremont, CA 94538, United States - Conference title
- 29th international electronics manufacturing technology symposium (San Jose CA CA, 14-16 July 2004)
- Conference name
- IEEE/CPMT/SEMI international electronics manufacturing technology. Symposium (29 ; San Jose CA 2004)
- Author (monograph)
- Institute of Electrical and Electronics Engineers, United States (Organiser of meeting)
- Source
29th international electronics manufacturing technology symposium (San Jose CA CA, 14-16 July 2004). 2004 ; 1Vol, pp 91-96, 6 p ; ref : 1 ref
- ISBN
- 0-7803-8582-9
- Scientific domain
- Electronics
- Publisher
- IEEE, Piscataway NJ
- Publication country
- United States
- Document type
- Conference Paper
- Language
- English
- Keyword (fr)
- Appareil portatif Assemblage brasage tendre Assemblage circuit intégré Brasage avec refusion Circuit intégré Circuit à la demande Diminution coût Dispositif à mémoire Facteur forme Fiabilité Fonction logique Interconnexion Matrice formage Packaging électronique Pastille électronique Processeur Radiocommunication service mobile Technologie BGA Technologie CSP Téléphone portable Microcâblage
- Keyword (en)
- Portable equipment Soldered joint Integrated circuit bonding Reflow soldering Integrated circuit Custom circuit Cost lowering Memory devices Form factor Reliability Logical function Interconnection Die Electronic packaging Wafer Processor Mobile radiocommunication BGA technology Chip scale packaging Mobile phone Wire bonding
- Keyword (es)
- Aparato portátil Junta soldada Soldeo con refusión Circuito integrado Circuito integrato personalizado Reducción costes Factor forma Fiabilidad Función lógica Interconexión Matriz formadora Packaging electrónico Pastilla electrónica Procesador Radiocomunicación servicio móvil Tecnología BGA Teléfono móvil Unión por hilo
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06A Design. Technologies. Operation analysis. Testing
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06B Integrated circuits by function (including memories and processors)
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03I Storage and reproduction of information / 001D03I02 Magnetic and optical mass memories
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 18162549
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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