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Nanoindentation and morphological studies of epoxy nanocomposites

Author
LU SHEN1 ; LEI WANG1 ; TIANXI LIU2 ; CHAOBIN HE1
[1] Institute of Materials Research and Engineering, 3 Research Link, Singapore 117602, Singapore
[2] Key Laboratory of Molecular Engineering of Polymers of Chinese Ministry of Education, Department of Macromolecular Science, Fudan University, 220 Handan Road, Shanghai 200433, China
Source

Macromolecular materials and engineering (Print). 2006, Vol 291, Num 11, pp 1358-1366, 9 p ; ref : 44 ref

ISSN
1438-7492
Scientific domain
Polymers, paint and wood industries
Publisher
Wiley-VCH, Weinheim
Publication country
Germany
Document type
Article
Language
English
Author keyword
clay epoxy fracture toughness nanocomposites nanoindentation
Keyword (fr)
Argile organique Courbe fluage Degré dispersion Dureté Effet concentration Epoxyde résine Etude expérimentale Module élasticité Montmorillonite Morphologie Nanocomposite Nanoindentation Ténacité Propriété mécanique
Keyword (en)
Organic clay Creep curve Dispersion degree Hardness Concentration effect Epoxy resin Experimental study Elastic modulus Montmorillonite Morphology Nanocomposite Nanoindentation Fracture toughness Mechanical properties
Keyword (es)
Arcilla orgánica Curva fluencia Grado dispersión Dureza Efecto concentración Epóxido resina Estudio experimental Módulo elasticidad Montmorilonita Morfología Nanocompuesto Nanoindentacion Tenacidad Propiedad mecánica
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D10 Polymer industry, paints, wood / 001D10A Technology of polymers / 001D10A06 Forms of application and semi-finished materials / 001D10A06H Composites

Discipline
Polymer industry, paints, wood
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
18299661

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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