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Reduction of ohmic contact resistivity on p-GaN using N2 plasma surface treatment at room temperature

Author
YINGWEN TANG1 ; DA YOU1 ; JINTONG XU1 ; XUE LI1 ; XIANGYANG LI1 ; HAIMEI GONG1
[1] State Key Laboratories of Transducer Technology, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai 200083, China
Source

Semiconductor science and technology. 2006, Vol 21, Num 12, pp 1597-1599, 3 p ; ref : 22 ref

CODEN
SSTEET
ISSN
0268-1242
Scientific domain
Electronics; Optics; Condensed state physics
Publisher
Institute of Physics, Bristol
Publication country
United Kingdom
Document type
Article
Language
English
Keyword (fr)
Caractéristique courant tension Contact ohmique Densité trou Gallium nitrure Hauteur barrière Niveau coeur Résistance contact Spectre photoélectron RX Traitement par plasma Traitement surface 7340C
Keyword (en)
IV characteristic Ohmic contacts Hole density Gallium nitrides Barrier height Core levels Contact resistance X-ray photoelectron spectra Plasma assisted processing Surface treatments
Classification
Pascal
001 Exact sciences and technology / 001B Physics / 001B70 Condensed matter: electronic structure, electrical, magnetic, and optical properties / 001B70C Electronic structure and electrical properties of surfaces, interfaces, thin films and low-dimensional structures / 001B70C40 Electronic transport in interface structures / 001B70C40C Contact resistance, contact potential

Discipline
Physics of condensed state : electronic structure, electrical, magnetic and optical properties
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
18314572

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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