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Multilayer polyimide film substrates for interconnections in microsystems

Author
FACH, A1 ; ATHANASSOV, Y1 ; BRUNNER, U1 ; HABLÜTZEL, D1 ; KETTERER, B1 ; LINK, J1
[1] Hightec MC AG, Fabrikstrasse, 5600 Lenzburg, Switzerland
Source

Microsystem technologies. 1999, Vol 5, Num 4, pp 166-168 ; ref : 1 ref

ISSN
0946-7076
Scientific domain
Electronics; Mechanical engineering; Metrology and instrumentation
Publisher
Springer, Berlin
Publication country
Germany
Document type
Article
Language
English
Keyword (fr)
Encapsulation Fabrication microélectronique Imide polymère Interconnexion Module multipuce Packaging électronique Processus fabrication Revêtement multicouche Structure flexible
Keyword (en)
Encapsulation Microelectronic fabrication Polyimide Interconnection Multichip module Electronic packaging Production process Multilayer coating Flexible structure
Keyword (es)
Encapsulación Fabricación microeléctrica Imida polímero Interconexión Modulo multipulga Packaging electrónico Proceso fabricación Revestimiento multicapa Estructura flexible
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F17 Microelectronic fabrication (materials and surfaces technology)

Discipline
Electronics
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
1869466

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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