Schwoebel effect and dynamic scaling behavior in nickel film growth by electrodeposition
- Author
- SAITOU, M1 ; CHINEN, T1 ; ODO, Y1
[1] Department of Mechanical Systems Engineering, University of the Ryukyus, I Senbaru Nishihara-cho, Okinawa 903-0213, Japan - Source
Surface & coatings technology. 1999, Vol 115, Num 2-3, pp 282-284 ; ref : 8 ref
- CODEN
- SCTEEJ
- ISSN
- 0257-8972
- Scientific domain
- General chemistry, physical chemistry; Metallurgy, welding
- Publisher
- Elsevier, Lausanne
- Publication country
- Switzerland
- Document type
- Article
- Language
- English
- Keyword (fr)
- Couche mince Dépôt électrolytique Etude expérimentale Microscopie force atomique Nickel Taux croissance
- Keyword (en)
- Thin films Electrodeposition Experimental study Atomic force microscopy Nickel Growth rate
- Classification
- Pascal
- 001 Exact sciences and technology / 001B Physics / 001B80 Cross-disciplinary physics: materials science; rheology / 001B80A Materials science / 001B80A15 Methods of deposition of films and coatings; film growth and epitaxy / 001B80A15P Electrodeposition, electroplating
- Discipline
- Physics and materials science
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 1884738
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1016/S0257-8972(99)00253-4 
https://dx.doi.org/10.1016/S0257-8972(99)00253-4
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