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Interfaces in lead-free solder alloys : Enthalpy of formation of binary Ag-Sn, Cu-Sn and Ni-Sn intermetallic compounds

Author
FLANDORFER, H1 ; SAEED, U1 ; LUEF, C1 ; SABBAR, A2 ; IPSER, H1
[1] Institute of Inorganic Chemistry/Materials Chemistry, University of Vienna, Waehringerstrasse 42, 1090 Wien, Austria
[2] Université Mohammed V, Faculté des Sciences, Laboratoire de Chimie Physique Générale, B.P 1014, Av. Ibn Batouta, Rabat, Morocco
Source

Thermochimica acta. 2007, Vol 459, Num 1-2, pp 34-39, 6 p ; ref : 20 ref

CODEN
THACAS
ISSN
0040-6031
Scientific domain
General chemistry, physical chemistry; Metallurgy, welding
Publisher
Elsevier Science, Amsterdam
Publication country
Netherlands
Document type
Article
Language
English
Author keyword
Calorimetry Enthalpy of formation Intermetallic compounds Lead-free solder alloy
Keyword (fr)
Alliage binaire Analyse thermique Argent alliage Brasage sans plomb Calorimétrie Composé intermétallique Cuivre alliage Energie libre formation Etain alliage Interface Nickel alliage Propriété thermodynamique
Keyword (en)
Binary alloy Thermal analysis Silver alloy Lead free soldering Calorimetry Intermetallic compound Copper alloy Formation free energy Tin alloy Interface Nickel alloy Thermodynamic properties
Keyword (es)
Aleación binaria Análisis térmico Plata aleación Soldeo sin plomo Calorimetría Compuesto intermetálico Cobre aleación Energía libre formación Estaño aleación Interfase Níquel aleación Propiedad termodinámica
Classification
Pascal
001 Exact sciences and technology / 001C Chemistry / 001C01 General and physical chemistry / 001C01E Chemical thermodynamics / 001C01E02 Thermodynamic properties / 001C01E02B Metals and alloys

Discipline
General chemistry and physical chemistry
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
18912750

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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