Migration of composite contact materials components at high current arcing
- Author
- WALCZUK, Eugeniusz1 ; BORKOWSKI, Piotr1 ; FRYDMAN, Krystyna2 ; WOJCIK-GRZYBEK, Danuta2 ; BUCHOLC, Witold2 ; HASEGAWA, Makoto3
[1] Technical University of Lodz, Lodz, Poland
[2] Institute of Electronics Materials Technology, Warsaw, Poland
[3] Chitose Institute of Science and Technology, Chitose-shi, 066-8655, Japan - Conference title
- Special section on recent development of electromechanical devices (Selected papers from ICEC2006)
- Conference name
- ICEC2006 International Conference on Electrical Contacts (23 ; Sendai 2006-06)
- Author (monograph)
- MINOWA, Isao (Editor)1
[1] Faculty of Engineering, Tamagawa University, Machida-shi, 194-8610, Japan - Source
IEICE transactions on electronics. 2007, Vol 90, Num 7, pp 1377-1384, 8 p ; ref : 13 ref
- ISSN
- 0916-8524
- Scientific domain
- Electronics
- Publisher
- Oxford University Press, Oxford
- Publication country
- United Kingdom
- Document type
- Conference Paper
- Language
- English
- Author keyword
- arc erosion contact materials electrical contacts material migration
- Keyword (fr)
- Anode Cathode Contact électrique Courant intense Matériau composite
- Keyword (en)
- Anode Cathode Electric contact High strength current Composite material
- Keyword (es)
- Anodo Cátodo Contacto eléctrico Corriente intensa Material compuesto
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F01 Interfaces
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 18956083
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1093/ietele/e90-c.7.1377 
https://dx.doi.org/10.1093/ietele/e90-c.7.1377
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