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Formation rate of vacancy-oxygen complexes in heat-treated Czochralski grown silicon under gamma-irradiation

Author
EMTSEV, V. V1 ; EMTSEV, V. V1 ; OGANESYAN, G. A1
[1] Solid State Electronics, Ioffe Physicotechnical Institute, Russian Academy of Sciences, Politekhnicheskaya ulitsa, 26, St. Petersburg 194021, Russian Federation
Conference title
Papers presented at the second international workshop: Coordination action on defects relevant to engineering silicon-based devices (Crete, September 2006)
Conference name
Coordination Action on Defects Relevant to Engineering Silicon-Based Devices. International Workshop (2 ; Kalives, Crete 2006-09-08)
Author (monograph)
EVANS-FREEMAN, Jan (Editor)1
European Commission, CADRES Project, Europe (Organiser of meeting)
[1] Sheffield Hallam University, Sheffield, United Kingdom
Source

Journal of materials science. Materials in electronics. 2007, Vol 18, Num 7, pp 701-704, 4 p ; ref : 10 ref

ISSN
0957-4522
Scientific domain
Electronics; Condensed state physics
Publisher
Springer, Norwell, MA
Publication country
United States
Document type
Conference Paper
Language
Russian
Keyword (fr)
Irradiation gamma Lacune Microscopie électronique Oxygène Silicium Température ambiante Traitement thermique O Si
Keyword (en)
Gamma irradiation Vacancy Electron microscopy Oxygen Silicon Room temperature Heat treatment
Keyword (es)
Irradiación gama Cavidad Microscopía electrónica Oxígeno Silicio Temperatura ambiente Tratamiento térmico
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03C Materials

Discipline
Electronics
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
18965017

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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