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Influence of thermal contact resistance on thermal impedance of microelectronic structures

Author
VERMEERSCH, B1 ; DE MEY, G1
[1] Ghent University, Department of Electronics and Information Systems (ELIS), Sint Pietersnieuwstraat 41, 9000 Gent, Belgium
Source

Microelectronics and reliability. 2007, Vol 47, Num 8, pp 1233-1238, 6 p ; ref : 13 ref

CODEN
MCRLAS
ISSN
0026-2714
Scientific domain
Electronics
Publisher
Elsevier, Oxford
Publication country
United Kingdom
Document type
Article
Language
English
Keyword (fr)
Assemblage collé Contact thermique Céramique Haute fréquence Impédance Microélectronique Modélisation Packaging électronique Résistance thermique contact Résistance thermique
Keyword (en)
Adhesive joint Thermal contact Ceramic materials High frequency Impedance Microelectronics Modeling Electronic packaging Contact thermal resistance Thermal resistance
Keyword (es)
Ensambladura pegada Contacto térmico Cerámica Alta frecuencia Impedancia Microelectrónica Modelización Packaging electrónico Resistencia térmica contacto Resistencia térmica
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06A Design. Technologies. Operation analysis. Testing

Discipline
Electronics
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
18980936

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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