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Cracking of densely coated layer adhesively bonded to porous substrates under Hertzian stress

Author
KEE SUNG LEE1 ; SANG KYUM KIM1 ; KIM, Chul1 ; TAE WOO KIM1 ; DO KYUNG KIM2
[1] School of Mechanical and Automotive Engineering, Kookmin University, Seoul 136-702, Korea, Republic of
[2] Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, Yuseong, Daejeon 305-701, Korea, Republic of
Source

Journal of materials science. 2007, Vol 42, Num 21, pp 9116-9120, 5 p ; ref : 17 ref

CODEN
JMTSAS
ISSN
0022-2461
Scientific domain
Chemical industry parachemical industry; Metallurgy, welding; Condensed state physics; Polymers, paint and wood industries
Publisher
Springer, Heidelberg
Publication country
Germany
Document type
Article
Language
English
Keyword (fr)
Collage Epoxyde résine Etude expérimentale Fissuration Matériau poreux Microscopie électronique balayage Porosité Propriété mécanique Revêtement dur Substrat Verre Substrat Al2O3 poreux
Keyword (en)
Adhesive bonding Epoxy resin Experimental study Cracking Porous materials Scanning electron microscopy Porosity Mechanical properties Hard coating Substrates Glass
Keyword (es)
Enlace adhesivo Epóxido resina Revestimiento duro
Classification
Pascal
001 Exact sciences and technology / 001B Physics / 001B60 Condensed matter: structure, mechanical and thermal properties / 001B60H Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties) / 001B60H60 Physical properties of thin films, nonelectronic / 001B60H60B Mechanical and acoustical properties

Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D08 Chemical industry and chemicals / 001D08B Building materials. Ceramics. Glasses / 001D08B06 Glasses / 001D08B06C Structure, analysis, properties

Pacs
6860B Mechanical and acoustical properties

Discipline
Chemical and parachemical industries Physics of condensed state : structure, mechanical and thermal properties
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
19087780

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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