Multi-level step and flash imprint lithography for direct patterning of dielectrics
- Author
- JEN, Wei-Lun1 2 ; PALMIERI, Frank1 ; CHAO, Brook1 ; LIN, Michael1 ; JIANJUN HAO1 ; OWENS, Jordan3 ; SOTOODEH, Ken3 ; CHEUNG, Robin4 ; WILLSON, C. Grant1
[1] The University of Texas at Austin, Austin, TX 78712, United States
[2] Dept. Chemical Engineering, M/S C0400, UT-Austin, Austin, TX 78712, United States
[3] ATDF, Inc., 2706 Montopolis Dr, Austin, TX 78741, United States
[4] Applied Materials, 3050 Bowers Ave, Santa Clara, CA 95054, United States - Conference title
- Emerging lithographic technologies XI (27 February- 1 March 2007, San Jose, California, USA)
- Conference name
- Emerging lithographic technologies (11 ; San Jose CA 2007)
- Author (monograph)
- Lercel, Michael James (Editor)
Society of photo-optical instrumentation engineers, United States (Organiser of meeting)
SEMATECH, Inc, United States (Organiser of meeting) - Source
Proceedings of SPIE, the International Society for Optical Engineering. 2007, pp 65170K.1-65170K.9 ; ref : 9 ref
- CODEN
- PSISDG
- ISSN
- 0277-786X
- ISBN
- 978-0-8194-6636-5
- Scientific domain
- Electronics; Optics; Physics
- Publisher
- SPIE, Bellingham WA
- Publication country
- United States
- Document type
- Conference Paper
- Language
- English
- Keyword (fr)
- Circuit accordable Circuit intégré Câblage Damasquinage Diélectrique Fabrication microélectronique Formation motif Interconnexion Lithographie Microprocesseur Méthode multipas Pastille électronique Photolithographie Polissage mécanochimique Système n niveaux Technologie tranchée Vitesse gravure
- Keyword (en)
- Tunable circuit Integrated circuit Wiring Damascene process Dielectric materials Microelectronic fabrication Patterning Interconnection Lithography Microprocessor Multistep method Wafer Photolithography Chemical mechanical polishing Multilevel system Trench technology Etching rate
- Keyword (es)
- Circuito acordable Circuito integrado Colocación cables Damasquinado Dieléctrico Fabricación microeléctrica Formacíon motivo Interconexión Litografía Microprocesador Método multipaso Pastilla electrónica Fotolitografía Sistema n niveles Tecnología trinchera Velocidad grabado
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06A Design. Technologies. Operation analysis. Testing
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06B Integrated circuits by function (including memories and processors)
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F17 Microelectronic fabrication (materials and surfaces technology)
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 19104445
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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