Debris mitigation techniques for a Sn-and Xe-fueled EUV light source
- Author
- THOMPSON, Keith C1 ; SRIVASTAVA, Shailendra N1 ; ANTONSEN, Erik L1 ; RUZIC, David N1
[1] Center for Plasma-Material Interactions University of Illinois at Urbana-Champaign, IL 61801, United States - Conference title
- Emerging lithographic technologies XI (27 February- 1 March 2007, San Jose, California, USA)
- Conference name
- Emerging lithographic technologies (11 ; San Jose CA 2007)
- Author (monograph)
- Lercel, Michael James (Editor)
Society of photo-optical instrumentation engineers, United States (Organiser of meeting)
SEMATECH, Inc, United States (Organiser of meeting) - Source
Proceedings of SPIE, the International Society for Optical Engineering. 2007, pp 65173L.1-65173L.11 ; ref : 12 ref
- CODEN
- PSISDG
- ISSN
- 0277-786X
- ISBN
- 978-0-8194-6636-5
- Scientific domain
- Electronics; Optics; Physics
- Publisher
- SPIE, Bellingham WA
- Publication country
- United States
- Document type
- Conference Paper
- Language
- English
- Keyword (fr)
- Endommagement Galette microcanaux Méthode temps vol Particule chargée Plaque parallèle Rayonnement UV extrême Source lumière 4272
- Keyword (en)
- Damage Microchannel plates Time-of-flight method Charged particles Parallel plate Extreme ultraviolet radiation Light sources
- Keyword (es)
- Placa paralela
- Classification
- Pascal
- 001 Exact sciences and technology / 001B Physics / 001B40 Fundamental areas of phenomenology (including applications) / 001B40B Optics / 001B40B72 Optical sources and standards
- Discipline
- Physics : optics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 19104532
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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