Integral representation of energy release rate in graded materials
- Author
- JIN, Z.-H1 ; SUN, C. T1
[1] School of Aeronautics and Astronautics, Purdue University, West Lafayette, IN 47907, United States - Source
Journal of applied mechanics. 2007, Vol 74, Num 5, pp 1046-1048, 3 p ; ref : 6 ref
- CODEN
- JAMCAV
- ISSN
- 0021-8936
- Scientific domain
- Mechanical engineering; Mechanics acoustics
- Publisher
- American Society of Mechanical Engineers, New York, NY
- Publication country
- United States
- Document type
- Article
- Language
- English
- Keyword (fr)
- Couche interfaciale Effet écran Elastoplasticité Energie potentielle Intégrale J Inélasticité Matériau gradient fonctionnel Matériau homogène Matériau hétérogène Modélisation Plasticité Propagation fissure Restitution énergie Rupture
- Keyword (en)
- Interfacial layer Shielding effect Elastoplasticity Potential energy J integral Inelasticity Functionnally graded material Homogeneous material Heterogeneous material Modeling Plasticity Crack propagation Energy release Rupture
- Keyword (es)
- Capa interfacial Efecto pantalla Elastoplasticidad Energía potencial Integral J Inelasticidad Material gradiente functional Material homogéneo Material heterogéneo Modelización Plasticidad Propagación fisura Restitución energía Ruptura
- Classification
- Pascal
- 001 Exact sciences and technology / 001B Physics / 001B40 Fundamental areas of phenomenology (including applications) / 001B40F Solid mechanics / 001B40F30 Structural and continuum mechanics / 001B40F30J Inelasticity (thermoplasticity, viscoplasticity...)
- Discipline
- Physics : solid mechanics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 19135789
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1115/1.2712236 
https://dx.doi.org/10.1115/1.2712236
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