The analysis of current distributions in filamentary conductors : The influence of intergrowths
- Author
- VOLKOZUB, A. V1 ; EVERETT, J1 ; PERKINS, G1 ; BUSCEMI, P1 ; CAPLIN, A. D1 ; DHALLE, M2 ; MARTI, F2 ; GRASSO, G2 ; HUANG, Y. B2 ; FLÜKIGER, R2
[1] Blackett Laboratory, Imperial College, London SW7 2BZ, United Kingdom
[2] Département de Physique de la Matière Condensée (DPMC), Université de Genévé, Switzerland - Conference title
- The 1998 Applied Superconductivity Conference. Part II
- Conference name
- The 1998 Applied Superconductivity Conference (ASC-98) (ASC-98) (Palm Desert, CA 1998-09-13)
- Author (monograph)
- Lawrence Berkeley National Laboratory, Berkeley, United States (Funder/Sponsor)
US Department of Energy ; Division of High Energy Physics, Washington DC, United States (Funder/Sponsor)
US Department of Energy ; Superconductivity Program for Electric Power, Washington DC, United States (Funder/Sponsor)
Mirassou Vineyards, United States (Funder/Sponsor)
Educational Institute for Superconductivity IISSC, United States (Funder/Sponsor)
Intermagnetics General Corporation, Latham NY, United States (Funder/Sponsor)
IEEE ; Committee on Applied Superconductivity, United States (Funder/Sponsor) - Source
IEEE transactions on applied superconductivity. 1999, Vol 9, Num 2, pp 2147-2150 ; 2 ; ref : 6 ref
- ISSN
- 1051-8223
- Scientific domain
- Electronics; Electrical engineering
- Publisher
- Institute of Electrical and Electronics Engineers, New York, NY
- Publication country
- United States
- Document type
- Conference Paper
- Language
- English
- Keyword (fr)
- Bismuth composé Calcium composé Caractéristique courant tension Couche oxyde Cuivre composé Densité courant critique Effet rémanent Intercroissance Isolation électrique Joint grain Mesure magnétique Strontium composé Supraconducteur haute température Supraconducteur multibrin Bi Ca Cu O Sr BiSr2Ca2Cu3Ox
- Keyword (en)
- Bismuth compound Calcium compound Voltage current curve Oxide layer Copper compound Critical current density Remanent effect Intergrowth Electrical insulation Grain boundary Magnetic measurement Strontium compound High temperature superconductor Multifilamentary superconductor
- Keyword (es)
- Bismuto compuesto Calcio compuesto Característica corriente tensión Capa óxido Cobre compuesto Densidad corriente crítica Efecto remanente Intercrecimiento Aislamiento eléctrico Limite grano Medida magnética Estroncio compuesto Supraconductor alta temperatura Supraconductor multifilamentario
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F11 Superconducting devices
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 1933809
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
Access to the document
Install on your browser
DOI
10.1109/77.784892 
https://dx.doi.org/10.1109/77.784892
"O:13:\"PanistOpenUrl\":36:{s:10:\"\u0000*\u0000openUrl\";N;s:6:\"\u0000*\u0000idc\";N;s:6:\"\u0000*\u0000fmt\";s:10:\"proceeding\";s:6:\"\u0000*\u0000doi\";s:17:\"10.1109\/77.784892\";s:6:\"\u0000*\u0000pii\";s:0:\"\";s:7:\"\u0000*\u0000pmid\";s:0:\"\";s:9:\"\u0000*\u0000atitle\";s:95:\"The analysis of current distributions in filamentary conductors : The influence of intergrowths\";s:9:\"\u0000*\u0000jtitle\";s:46:\"IEEE transactions on applied superconductivity\";s:9:\"\u0000*\u0000stitle\";s:27:\"IEEE trans. appl. supercond\";s:7:\"\u0000*\u0000date\";s:4:\"1999\";s:9:\"\u0000*\u0000volume\";s:1:\"9\";s:8:\"\u0000*\u0000issue\";s:1:\"2\";s:8:\"\u0000*\u0000spage\";s:4:\"2147\";s:8:\"\u0000*\u0000epage\";s:4:\"2150\";s:8:\"\u0000*\u0000pages\";s:0:\"\";s:7:\"\u0000*\u0000issn\";s:9:\"1051-8223\";s:8:\"\u0000*\u0000eissn\";s:0:\"\";s:9:\"\u0000*\u0000aulast\";s:8:\"VOLKOZUB\";s:10:\"\u0000*\u0000aufirst\";s:4:\"A. V\";s:9:\"\u0000*\u0000auinit\";s:0:\"\";s:10:\"\u0000*\u0000auinitm\";s:0:\"\";s:5:\"\u0000*\u0000au\";a:9:{i:0;s:10:\"EVERETT, J\";i:1;s:10:\"PERKINS, G\";i:2;s:10:\"BUSCEMI, P\";i:3;s:12:\"CAPLIN, A. D\";i:4;s:9:\"DHALLE, M\";i:5;s:8:\"MARTI, F\";i:6;s:9:\"GRASSO, G\";i:7;s:11:\"HUANG, Y. B\";i:8;s:12:\"FL\u00dcKIGER, R\";}s:9:\"\u0000*\u0000aucorp\";s:0:\"\";s:7:\"\u0000*\u0000isbn\";s:0:\"\";s:8:\"\u0000*\u0000coden\";s:0:\"\";s:8:\"\u0000*\u0000genre\";s:10:\"proceeding\";s:7:\"\u0000*\u0000part\";s:1:\"2\";s:9:\"\u0000*\u0000btitle\";s:54:\"The 1998 Applied Superconductivity Conference. Part II\";s:8:\"\u0000*\u0000title\";s:95:\"The analysis of current distributions in filamentary conductors : The influence of intergrowths\";s:8:\"\u0000*\u0000place\";s:12:\"New York, NY\";s:6:\"\u0000*\u0000pub\";s:49:\"Institute of Electrical and Electronics Engineers\";s:10:\"\u0000*\u0000edition\";s:0:\"\";s:9:\"\u0000*\u0000tpages\";s:0:\"\";s:9:\"\u0000*\u0000series\";s:0:\"\";s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";b:1;}"
Panist access
"O:12:\"IstexOpenUrl\":35:{s:10:\"\u0000*\u0000openUrl\";N;s:6:\"\u0000*\u0000fmt\";s:10:\"proceeding\";s:6:\"\u0000*\u0000doi\";s:17:\"10.1109\/77.784892\";s:6:\"\u0000*\u0000pii\";s:0:\"\";s:7:\"\u0000*\u0000pmid\";s:0:\"\";s:9:\"\u0000*\u0000atitle\";s:95:\"The analysis of current distributions in filamentary conductors : The influence of intergrowths\";s:9:\"\u0000*\u0000jtitle\";s:46:\"IEEE transactions on applied superconductivity\";s:9:\"\u0000*\u0000stitle\";s:27:\"IEEE trans. appl. supercond\";s:7:\"\u0000*\u0000date\";s:4:\"1999\";s:9:\"\u0000*\u0000volume\";s:1:\"9\";s:8:\"\u0000*\u0000issue\";s:1:\"2\";s:8:\"\u0000*\u0000spage\";s:4:\"2147\";s:8:\"\u0000*\u0000epage\";s:4:\"2150\";s:8:\"\u0000*\u0000pages\";s:0:\"\";s:7:\"\u0000*\u0000issn\";s:9:\"1051-8223\";s:8:\"\u0000*\u0000eissn\";s:0:\"\";s:9:\"\u0000*\u0000aulast\";s:8:\"VOLKOZUB\";s:10:\"\u0000*\u0000aufirst\";s:4:\"A. V\";s:9:\"\u0000*\u0000auinit\";s:0:\"\";s:10:\"\u0000*\u0000auinitm\";s:0:\"\";s:5:\"\u0000*\u0000au\";a:9:{i:0;s:10:\"EVERETT, J\";i:1;s:10:\"PERKINS, G\";i:2;s:10:\"BUSCEMI, P\";i:3;s:12:\"CAPLIN, A. D\";i:4;s:9:\"DHALLE, M\";i:5;s:8:\"MARTI, F\";i:6;s:9:\"GRASSO, G\";i:7;s:11:\"HUANG, Y. B\";i:8;s:12:\"FL\u00dcKIGER, R\";}s:9:\"\u0000*\u0000aucorp\";s:0:\"\";s:7:\"\u0000*\u0000isbn\";s:0:\"\";s:8:\"\u0000*\u0000coden\";s:0:\"\";s:8:\"\u0000*\u0000genre\";s:10:\"proceeding\";s:7:\"\u0000*\u0000part\";s:1:\"2\";s:9:\"\u0000*\u0000btitle\";s:54:\"The 1998 Applied Superconductivity Conference. Part II\";s:8:\"\u0000*\u0000title\";s:95:\"The analysis of current distributions in filamentary conductors : The influence of intergrowths\";s:8:\"\u0000*\u0000place\";s:12:\"New York, NY\";s:6:\"\u0000*\u0000pub\";s:49:\"Institute of Electrical and Electronics Engineers\";s:10:\"\u0000*\u0000edition\";s:0:\"\";s:9:\"\u0000*\u0000tpages\";s:0:\"\";s:9:\"\u0000*\u0000series\";s:0:\"\";s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";b:1;}"
Istex access
"O:16:\"UnpaywallOpenUrl\":35:{s:8:\"\u0000*\u0000email\";s:27:\"assistance-portail@inist.fr\";s:6:\"\u0000*\u0000fmt\";N;s:6:\"\u0000*\u0000doi\";s:17:\"10.1109\/77.784892\";s:6:\"\u0000*\u0000pii\";N;s:7:\"\u0000*\u0000pmid\";N;s:9:\"\u0000*\u0000atitle\";N;s:9:\"\u0000*\u0000jtitle\";N;s:9:\"\u0000*\u0000stitle\";N;s:7:\"\u0000*\u0000date\";N;s:9:\"\u0000*\u0000volume\";N;s:8:\"\u0000*\u0000issue\";N;s:8:\"\u0000*\u0000spage\";N;s:8:\"\u0000*\u0000epage\";N;s:8:\"\u0000*\u0000pages\";N;s:7:\"\u0000*\u0000issn\";N;s:8:\"\u0000*\u0000eissn\";N;s:9:\"\u0000*\u0000aulast\";N;s:10:\"\u0000*\u0000aufirst\";N;s:9:\"\u0000*\u0000auinit\";N;s:10:\"\u0000*\u0000auinitm\";N;s:5:\"\u0000*\u0000au\";N;s:9:\"\u0000*\u0000aucorp\";N;s:7:\"\u0000*\u0000isbn\";N;s:8:\"\u0000*\u0000coden\";N;s:8:\"\u0000*\u0000genre\";N;s:7:\"\u0000*\u0000part\";N;s:9:\"\u0000*\u0000btitle\";N;s:8:\"\u0000*\u0000title\";N;s:8:\"\u0000*\u0000place\";N;s:6:\"\u0000*\u0000pub\";N;s:10:\"\u0000*\u0000edition\";N;s:9:\"\u0000*\u0000tpages\";N;s:9:\"\u0000*\u0000series\";N;s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";N;}"
Unpaywall access
"O:16:\"EuropePMCOpenUrl\":35:{s:10:\"\u0000*\u0000openUrl\";N;s:6:\"\u0000*\u0000fmt\";s:10:\"proceeding\";s:6:\"\u0000*\u0000doi\";s:17:\"10.1109\/77.784892\";s:6:\"\u0000*\u0000pii\";s:0:\"\";s:7:\"\u0000*\u0000pmid\";s:0:\"\";s:9:\"\u0000*\u0000atitle\";s:95:\"The analysis of current distributions in filamentary conductors : The influence of intergrowths\";s:9:\"\u0000*\u0000jtitle\";s:46:\"IEEE transactions on applied superconductivity\";s:9:\"\u0000*\u0000stitle\";s:27:\"IEEE trans. appl. supercond\";s:7:\"\u0000*\u0000date\";s:4:\"1999\";s:9:\"\u0000*\u0000volume\";s:1:\"9\";s:8:\"\u0000*\u0000issue\";s:1:\"2\";s:8:\"\u0000*\u0000spage\";s:4:\"2147\";s:8:\"\u0000*\u0000epage\";s:4:\"2150\";s:8:\"\u0000*\u0000pages\";s:0:\"\";s:7:\"\u0000*\u0000issn\";s:9:\"1051-8223\";s:8:\"\u0000*\u0000eissn\";s:0:\"\";s:9:\"\u0000*\u0000aulast\";s:8:\"VOLKOZUB\";s:10:\"\u0000*\u0000aufirst\";s:4:\"A. V\";s:9:\"\u0000*\u0000auinit\";s:0:\"\";s:10:\"\u0000*\u0000auinitm\";s:0:\"\";s:5:\"\u0000*\u0000au\";a:9:{i:0;s:10:\"EVERETT, J\";i:1;s:10:\"PERKINS, G\";i:2;s:10:\"BUSCEMI, P\";i:3;s:12:\"CAPLIN, A. D\";i:4;s:9:\"DHALLE, M\";i:5;s:8:\"MARTI, F\";i:6;s:9:\"GRASSO, G\";i:7;s:11:\"HUANG, Y. B\";i:8;s:12:\"FL\u00dcKIGER, R\";}s:9:\"\u0000*\u0000aucorp\";s:0:\"\";s:7:\"\u0000*\u0000isbn\";s:0:\"\";s:8:\"\u0000*\u0000coden\";s:0:\"\";s:8:\"\u0000*\u0000genre\";s:10:\"proceeding\";s:7:\"\u0000*\u0000part\";s:1:\"2\";s:9:\"\u0000*\u0000btitle\";s:54:\"The 1998 Applied Superconductivity Conference. Part II\";s:8:\"\u0000*\u0000title\";s:95:\"The analysis of current distributions in filamentary conductors : The influence of intergrowths\";s:8:\"\u0000*\u0000place\";s:12:\"New York, NY\";s:6:\"\u0000*\u0000pub\";s:49:\"Institute of Electrical and Electronics Engineers\";s:10:\"\u0000*\u0000edition\";s:0:\"\";s:9:\"\u0000*\u0000tpages\";s:0:\"\";s:9:\"\u0000*\u0000series\";s:0:\"\";s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";b:1;}"
Europe PubMed Central access
"O:11:\"BaseOpenUrl\":35:{s:10:\"\u0000*\u0000openUrl\";N;s:6:\"\u0000*\u0000fmt\";s:10:\"proceeding\";s:6:\"\u0000*\u0000doi\";s:17:\"10.1109\/77.784892\";s:6:\"\u0000*\u0000pii\";s:0:\"\";s:7:\"\u0000*\u0000pmid\";s:0:\"\";s:9:\"\u0000*\u0000atitle\";s:95:\"The analysis of current distributions in filamentary conductors : The influence of intergrowths\";s:9:\"\u0000*\u0000jtitle\";s:46:\"IEEE transactions on applied superconductivity\";s:9:\"\u0000*\u0000stitle\";s:27:\"IEEE trans. appl. supercond\";s:7:\"\u0000*\u0000date\";s:4:\"1999\";s:9:\"\u0000*\u0000volume\";s:1:\"9\";s:8:\"\u0000*\u0000issue\";s:1:\"2\";s:8:\"\u0000*\u0000spage\";s:4:\"2147\";s:8:\"\u0000*\u0000epage\";s:4:\"2150\";s:8:\"\u0000*\u0000pages\";s:0:\"\";s:7:\"\u0000*\u0000issn\";s:9:\"1051-8223\";s:8:\"\u0000*\u0000eissn\";s:0:\"\";s:9:\"\u0000*\u0000aulast\";s:8:\"VOLKOZUB\";s:10:\"\u0000*\u0000aufirst\";s:4:\"A. V\";s:9:\"\u0000*\u0000auinit\";s:0:\"\";s:10:\"\u0000*\u0000auinitm\";s:0:\"\";s:5:\"\u0000*\u0000au\";a:9:{i:0;s:10:\"EVERETT, J\";i:1;s:10:\"PERKINS, G\";i:2;s:10:\"BUSCEMI, P\";i:3;s:12:\"CAPLIN, A. D\";i:4;s:9:\"DHALLE, M\";i:5;s:8:\"MARTI, F\";i:6;s:9:\"GRASSO, G\";i:7;s:11:\"HUANG, Y. B\";i:8;s:12:\"FL\u00dcKIGER, R\";}s:9:\"\u0000*\u0000aucorp\";s:0:\"\";s:7:\"\u0000*\u0000isbn\";s:0:\"\";s:8:\"\u0000*\u0000coden\";s:0:\"\";s:8:\"\u0000*\u0000genre\";s:10:\"proceeding\";s:7:\"\u0000*\u0000part\";s:1:\"2\";s:9:\"\u0000*\u0000btitle\";s:54:\"The 1998 Applied Superconductivity Conference. Part II\";s:8:\"\u0000*\u0000title\";s:95:\"The analysis of current distributions in filamentary conductors : The influence of intergrowths\";s:8:\"\u0000*\u0000place\";s:12:\"New York, NY\";s:6:\"\u0000*\u0000pub\";s:49:\"Institute of Electrical and Electronics Engineers\";s:10:\"\u0000*\u0000edition\";s:0:\"\";s:9:\"\u0000*\u0000tpages\";s:0:\"\";s:9:\"\u0000*\u0000series\";s:0:\"\";s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";b:1;}"
Base Search access
"O:12:\"ArXivOpenUrl\":35:{s:10:\"\u0000*\u0000openUrl\";N;s:6:\"\u0000*\u0000fmt\";s:10:\"proceeding\";s:6:\"\u0000*\u0000doi\";s:17:\"10.1109\/77.784892\";s:6:\"\u0000*\u0000pii\";s:0:\"\";s:7:\"\u0000*\u0000pmid\";s:0:\"\";s:9:\"\u0000*\u0000atitle\";s:95:\"The analysis of current distributions in filamentary conductors : The influence of intergrowths\";s:9:\"\u0000*\u0000jtitle\";s:46:\"IEEE transactions on applied superconductivity\";s:9:\"\u0000*\u0000stitle\";s:27:\"IEEE trans. appl. supercond\";s:7:\"\u0000*\u0000date\";s:4:\"1999\";s:9:\"\u0000*\u0000volume\";s:1:\"9\";s:8:\"\u0000*\u0000issue\";s:1:\"2\";s:8:\"\u0000*\u0000spage\";s:4:\"2147\";s:8:\"\u0000*\u0000epage\";s:4:\"2150\";s:8:\"\u0000*\u0000pages\";s:0:\"\";s:7:\"\u0000*\u0000issn\";s:9:\"1051-8223\";s:8:\"\u0000*\u0000eissn\";s:0:\"\";s:9:\"\u0000*\u0000aulast\";s:8:\"VOLKOZUB\";s:10:\"\u0000*\u0000aufirst\";s:4:\"A. V\";s:9:\"\u0000*\u0000auinit\";s:0:\"\";s:10:\"\u0000*\u0000auinitm\";s:0:\"\";s:5:\"\u0000*\u0000au\";a:9:{i:0;s:10:\"EVERETT, J\";i:1;s:10:\"PERKINS, G\";i:2;s:10:\"BUSCEMI, P\";i:3;s:12:\"CAPLIN, A. D\";i:4;s:9:\"DHALLE, M\";i:5;s:8:\"MARTI, F\";i:6;s:9:\"GRASSO, G\";i:7;s:11:\"HUANG, Y. B\";i:8;s:12:\"FL\u00dcKIGER, R\";}s:9:\"\u0000*\u0000aucorp\";s:0:\"\";s:7:\"\u0000*\u0000isbn\";s:0:\"\";s:8:\"\u0000*\u0000coden\";s:0:\"\";s:8:\"\u0000*\u0000genre\";s:10:\"proceeding\";s:7:\"\u0000*\u0000part\";s:1:\"2\";s:9:\"\u0000*\u0000btitle\";s:54:\"The 1998 Applied Superconductivity Conference. Part II\";s:8:\"\u0000*\u0000title\";s:95:\"The analysis of current distributions in filamentary conductors : The influence of intergrowths\";s:8:\"\u0000*\u0000place\";s:12:\"New York, NY\";s:6:\"\u0000*\u0000pub\";s:49:\"Institute of Electrical and Electronics Engineers\";s:10:\"\u0000*\u0000edition\";s:0:\"\";s:9:\"\u0000*\u0000tpages\";s:0:\"\";s:9:\"\u0000*\u0000series\";s:0:\"\";s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";b:1;}"
arXiv access
