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Measurement of fracture stress, Young's modulus, and intrinsic stress of heavily boron-doped silicon microstructures

Author
NAJAFI, K; SUZUKI, K
Univ. Michigan, cent. integrated sensors circuits, dep. electrical eng. computer sci., Ann Arbor MI 48109-2122, United States
Conference name
International conference on metallurgical coatings (San Diego CA 1989-04-17)
Source

Thin solid films. 1989, Vol 181, Num 1-2, pp 251-258, 8 p ; ref : 13 ref

CODEN
THSFAP
ISSN
0040-6090
Scientific domain
Crystallography; Electronics; Metallurgy, welding; Condensed state physics
Publisher
Elsevier Science, Lausanne
Publication country
Switzerland
Document type
Conference Paper
Language
English
Classification
Pascal
001 Exact sciences and technology / 001B Physics / 001B60 Condensed matter: structure, mechanical and thermal properties / 001B60B Mechanical and acoustical properties of condensed matter

Discipline
Physics of condensed state : structure, mechanical and thermal properties
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
19360078

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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