A novel wafer-level hermetic packaging for MEMS devices
- Author
- TSOU, Chingfu1 ; HUNGCHUNG LI1 ; CHANG, Hsing-Cheng1
[1] Department of Automatic Control Engineering, Feng Chia University, Taichung 40724, Taiwan, Province of China - Source
IEEE transactions on advanced packaging. 2007, Vol 30, Num 4, pp 616-621, 6 p ; ref : 20 ref
- ISSN
- 1521-3323
- Scientific domain
- Electronics
- Publisher
- Institute of Electrical and Electronics Engineers, Piscataway, NY
- Publication country
- United States
- Document type
- Article
- Language
- English
- Author keyword
- Hermetic packaging microelectromechanical system (MEMS) wafer-level
- Keyword (fr)
- Actionneur Assemblage brasage tendre Assemblage circuit intégré Basse pression Brasage avec refusion Capteur mesure Chambre à vide Contact bosse Diminution coût Dispositif microélectromécanique Evaluation performance Fabrication microélectronique Fixation pastille Haute performance Packaging électronique Pastille électronique Technologie CSP Trou interconnexion Vide poussé 0707D
- Keyword (en)
- Actuator Soldered joint Integrated circuit bonding Low pressure Reflow soldering Measurement sensor Vacuum chamber Solder bump Cost lowering Microelectromechanical device Performance evaluation Microelectronic fabrication Wafer bonding High performance Electronic packaging Wafer Chip scale packaging Via hole High vacuum
- Keyword (es)
- Accionador Junta soldada Baja presión Soldeo con refusión Captador medida Cámara de vacío Contacto con bollos Reducción costes Dispositivo microelectromecánico Evaluación prestación Fabricación microeléctrica Fijación pastilla Alto rendimiento Packaging electrónico Pastilla electrónica Agujero interconexión
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D02 Computer science; control theory; systems / 001D02D Control theory. Systems / 001D02D11 Robotics
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06A Design. Technologies. Operation analysis. Testing
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F17 Microelectronic fabrication (materials and surfaces technology)
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F21 Micro- and nanoelectromechanical devices (mems/nems)
- Discipline
- Computer science : theoretical automation and systems Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 19681471
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1109/TADVP.2007.906236 
https://dx.doi.org/10.1109/TADVP.2007.906236
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