MISE AU POINT ET CARACTERISATION DE PROCEDES PLASMA INTERVENANT LORS DE L'ELABORATION DES INTERCONNECXIONS POUR LES FILIERES CMOS
- Other title
- Starting and characterization of plasma proceedings stepping in the CMOS lines interconections elaboration (en)
- Author
- Czyprynski, Pascal; Ranson, Pierre (Advisor (for a thesis or dissertation))
Université d'Orléans, Orléans, France (Degree-grantor) - Source
MISE AU POINT ET CARACTERISATION DE PROCEDES PLASMA INTERVENANT LORS DE L'ELABORATION DES INTERCONNECXIONS POUR LES FILIERES CMOS. 1999, 165 p., ref : 163 ref
- Thesis number
- 99 ORLE 2007
- Document type
- Thesis (New Ph.D. thesis)
- Language
- French
- Keyword (fr)
- Aluminium Analyse surface Corrosion Etude expérimentale Fabrication microélectronique Gravure plasma Interconnexion Silicium oxyde Spectrométrie fluorescence RX Spectrométrie photoélectron Technologie MOS complémentaire Trou interconnexion Gravure anisotropique
- Keyword (en)
- Aluminium Surface analysis Corrosion Experimental study Microelectronic fabrication Plasma etching Interconnection Silicon oxides X ray fluorescence spectrometry Photoelectron spectrometry Complementary MOS technology Via hole Anisotropic etching
- Keyword (es)
- Aluminio Análisis superficie Corrosión Estudio experimental Fabricación microeléctrica Grabado plasma Interconexión Espectrometría fluorescencia RX Espectrometría fotoelectrón Tecnología MOS complementario Agujero interconexión
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F17 Microelectronic fabrication (materials and surfaces technology)
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 198076
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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