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The contact resistance and reliability of anisotropically conductive film (ACF)

Author
YIM, M.-J1 ; PAIK, K.-W1
[1] Korea Advanced Institute of Science and Technology, Taejon, 305-701, Korea, Republic of
Conference title
Electronic Components and Technology Conference (ECTC)
Conference name
Electronic Components and Technology Conference (ECTC) (ECTC) (48 ; Seattle, WA 1998-05-25)
Author (monograph)
KRUSIUS, J. Peter (Editor)1
[1] Cornell University, Ithaca, NY 14853, United States
Source

IEEE transactions on advanced packaging. 1999, Vol 22, Num 2, pp 166-173 ; ref : 11 ref

ISSN
1521-3323
Scientific domain
Electronics
Publisher
Institute of Electrical and Electronics Engineers, Piscataway, NY
Publication country
United States
Document type
Conference Paper
Language
English
Keyword (fr)
Circuit intégré Conception circuit Cristal liquide Fiabilité Force adhérence Interconnexion Matériau anisotrope Packaging électronique Propriété mécanique Propriété électrique Résistance contact ACF
Keyword (en)
Integrated circuit Circuit design Liquid crystals Reliability Adhesive strength Interconnection Anisotropic material Electronic packaging Mechanical properties Electrical properties Contact resistance
Keyword (es)
Circuito integrado Concepción circuito Cristal líquido Fiabilidad Fuerza adherencia Interconexión Material anisótropo Packaging electrónico Propiedad mecánica Propiedad eléctrica Resistencia contacto
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06A Design. Technologies. Operation analysis. Testing

Discipline
Electronics
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
2002760

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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