Moisture sensitivity characterization of build-up ball grid array substrates
- Author
- PECHT, M. G1
[1] CALCE Electronic Products and Systems Center, University of Maryland, College Park, MD 20742, United States - Conference title
- IEEE Topical Meeting on Electrical Performance of Electronic Packaging
- Conference name
- IEEE Topical Meeting on Electrical Performance of Electronic Packaging (7 ; West Point, NY 1998-10-26)
- Author (monograph)
- DEUTSCH, Alina (Editor)1 ; SWAMINATHAN, Madhavan (Editor)2
[1] IBM Corporation, Yorktown Heights, NY 10598, United States
[2] Georgia Institute of Technology, Atlanta, GA 30332-0250, United States - Source
IEEE transactions on advanced packaging. 1999, Vol 22, Num 3, pp 515-523 ; ref : 4 ref
- ISSN
- 1521-3323
- Scientific domain
- Electronics
- Publisher
- Institute of Electrical and Electronics Engineers, Piscataway, NY
- Publication country
- United States
- Document type
- Conference Paper
- Language
- English
- Keyword (fr)
- Analyse sensibilité Brouillage Coefficient dilatation thermique Encapsulation plastique Fiabilité Mesure humidité Microscopie électronique balayage Produit apport brasage tendre Préconditionnement Résultat expérimental
- Keyword (en)
- Sensitivity analysis Electromagnetic interference Thermal expansion coefficient Plastic packaging Reliability Moisture measurement Scanning electron microscopy Solder Preconditioning Experimental result
- Keyword (es)
- Análisis sensibilidad Interferencia Coeficiente dilatación térmica Encapsulación plástica Fiabilidad Medición humedad Microscopía electrónica barrido Producto aportación soldadura blanda Precondicionamiento Resultado experimental
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03B Testing, measurement, noise and reliability
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 2005193
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1109/6040.784506 
https://dx.doi.org/10.1109/6040.784506
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