Size distribution and morphology of Cu6Sn5 scallops in wetting reaction between molten solder and copper
- Author
- SUH, J. O1 ; TU, K. N1 ; LUTSENKO, G. V2 ; GUSAK, A. M2
[1] Department of Materials Science and Engineering, University of California at Los Angeles, Los Angeles, CA 90095-1595, United States
[2] Department of Theoretical Physics, Cherkasy National University, Cherkasy, Ukraine - Source
Acta materialia. 2008, Vol 56, Num 5, pp 1075-1083, 9 p ; ref : 13 ref
- ISSN
- 1359-6454
- Scientific domain
- Metallurgy, welding; Condensed state physics
- Publisher
- Elsevier Science, Oxford
- Publication country
- United Kingdom
- Document type
- Article
- Language
- English
- Author keyword
- Cu6Sn5 Ripening Solder wetting
- Keyword (fr)
- Brasage tendre Morphologie Mouillage Produit apport brasage tendre
- Keyword (en)
- Soldering Morphology Wetting Solder
- Keyword (es)
- Soldeo blando Morfología Remojo Producto aportación soldadura blanda
- Keyword (de)
- Weichloeten Morphologie Weichlot
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D11 Metals. Metallurgy / 001D11A General
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D11 Metals. Metallurgy / 001D11D Joining, thermal cutting: metallurgical aspects / 001D11D02 Brazing. Soldering
- Discipline
- Metals. Metallurgy
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 20139550
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1016/j.actamat.2007.11.009 
https://dx.doi.org/10.1016/j.actamat.2007.11.009
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