Pascal and Francis Bibliographic Databases

Help

Export

Selection :

Permanent link
http://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=20171453

The Maximum Fluidity Length of Solidifying Sn-Cu-Ag-Ni Solder Alloys

Author
GOURLAY, C. M1 ; READ, J1 ; NOGITA, K1 ; DAHLE, A. K1
[1] Materials Engineering, The University of Queensland, Brisbane, QLD 4072, Australia
Conference title
Lead-free electronic solders
Conference name
TMS 2007 Annual Meeting. Symposium Pb-free electronic solders: Alloy design, characterization and service reliability (Orlando, Florida 2007-02-25)
Author (monograph)
GUO, Fu (Editor)1 ; SUBRAMANIAN, K. N (Editor)2 ; KANG, Sung (Editor)3 ; CHADA, Srinivas (Editor)4 ; TURBINI, Laura (Editor)5 ; YU, Jin (Editor)6
Minerals, Metals & Materials Society (TMS), Warrendale, PA, United States (Organiser of meeting)
[1] Beijing University of Technology, Beijing, China
[2] Michigan State University, East Lansing, United States
[3] IBM T. J. Watson Research Center, Armonk, United States
[4] Medtronic Microelectronics Center, Tempe, United States
[5] University of Toronto, Toronto, Canada
[6] Korea Advanced Institute of Science and Technology, Daejeon, Korea, Republic of
Source

Journal of electronic materials. 2008, Vol 37, Num 1, pp 51-60, 10 p ; ref : 25 ref

CODEN
JECMA5
ISSN
0361-5235
Scientific domain
Crystallography; Electronics; Metallurgy, welding; Condensed state physics
Publisher
Institute of Electrical and Electronics Engineers, New York, NY
Publication country
United States
Document type
Conference Paper
Language
English
Author keyword
Lead-free soldering fluidity phase equilibria solidification
Keyword (fr)
Alliage base étain Alliage quaternaire Argent alliage Assemblage brasage tendre Brasage tendre Composition chimique Coupe transversale Cuivre alliage Diagramme phase Equilibre phase Fabrication microélectronique Microstructure Métal fondu brasage tendre Métallurgie soudage Nickel alliage Solidification Traitement thermique 8130F Brasure sans plomb SnAgCu
Keyword (en)
Tin base alloys Quaternary alloys Silver alloy Soldered joint Soldering Chemical composition Cross section Copper alloy Phase diagram Phase equilibrium Microelectronic fabrication Microstructure Solder metal Welding metallurgy Nickel alloy Solidification Heat treatment Lead free solder
Keyword (es)
Plata aleación Junta soldada Soldeo blando Composición química Corte transverso Cobre aleación Diagrama fase Equilibrio fase Fabricación microeléctrica Microestructura Metal fundido soldeo blando Metalurgia soldadura Níquel aleación Solidificación Tratamiento térmico
Keyword (de)
Silberlegierung Weichloetverbindung Weichloeten Chemische Zusammensetzung Kupferlegierung Phasendiagramm Mikrogefuege Weichloetgut Schweissmetallurgie Nickellegierung Erstarren Waermebehandlung
Classification
Pascal
001 Exact sciences and technology / 001B Physics / 001B80 Cross-disciplinary physics: materials science; rheology / 001B80A Materials science / 001B80A30 Phase diagrams and microstructures developed by solidification and solid-solid phase transformations / 001B80A30F Solidification

Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03C Materials

Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D11 Metals. Metallurgy / 001D11D Joining, thermal cutting: metallurgical aspects / 001D11D02 Brazing. Soldering

Discipline
Electronics Metals. Metallurgy Physics and materials science
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
20171453

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

Access to the document

Searching the Web