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Reduction of Cavity-to-Cavity Power/Ground Noise Coupling through Plane Cutout in Multi-layer PCBs

Author
LEE, Junwoo1 ; KIM, Myunghoi1 ; KIM, Joungho1 ; MIHAI DRAGOS ROTARU2 ; IYER, Mahadevan K2
[1] Terahertz Interconnection and Package Laboratory Department of EECS, KAIST 373-1 Gusong-dong, Yusong-gu, Daejeon, Korea, Republic of
[2] Institute of Microelectronics, 11 Science Park Road, Singapore Science Park II, Singapore 117685, Singapore
Conference title
EMC 2004 (2004 IEEE International Symposium on Electromagnetic Compatibility)
Conference name
IEEE International Symposium on Electromagnetic Compatibility (Santa Clara CA 2004)
Author (monograph)
IEEE Electromagnetic Compatibility Society, United States (Organiser of meeting)
Source

EMC 2004 (2004 IEEE International Symposium on Electromagnetic Compatibility). 2004 ; vol. 1, 35-38 ; ref : 5 ref

ISBN
0-7803-8443-1
Scientific domain
Electronics; Electrical engineering; Telecommunications
Publisher
IEEE, Piscataway NJ
Publication country
United States
Document type
Conference Paper
Language
English
Keyword (fr)
Carte électronique Cavité Circuit imprimé Conformation de bruit Localisation Multicouche Méthode réduction Simulation système
Keyword (en)
Printed circuit board Cavity Printed circuit Noise shaping Localization Multiple layer Reduction method System simulation
Keyword (es)
Tarjeta electronica Cavidad Circuito imprimido Modelado de ruido Localización Capa múltiple Método reducción Simulación sistema
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03D Electronic equipment and fabrication. Passive components, printed wiring boards, connectics

Discipline
Electronics
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
20204060

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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