Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging
- Author
- HANG, C. J1 2 ; WANG, C. Q1 ; MAYER, M2 ; TIAN, Y. H1 ; ZHOU, Y2 ; WANG, H. H3
[1] State Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001, China
[2] Centre for Advanced Materials Joining, University of Waterloo, Waterloo, Ontario N2L 3G1, Canada
[3] Nantong Fujistu Microelectronics Co. Ltd, Jiangsu 226001, China - Source
Microelectronics and reliability. 2008, Vol 48, Num 3, pp 416-424, 9 p ; ref : 28 ref
- CODEN
- MCRLAS
- ISSN
- 0026-2714
- Scientific domain
- Electronics
- Publisher
- Elsevier, Oxford
- Publication country
- United Kingdom
- Document type
- Article
- Language
- English
- Keyword (fr)
- Caractéristique électrique Cavitation Cavité Circuit intégré Composé intermétallique Couche interfaciale Croissance film Diffraction RX Fiabilité Fissure Interconnexion Microcâblage Microscopie optique Microélectronique Multicouche Propriété mécanique Rupture Résistance contact Vieillissement thermique
- Keyword (en)
- Electrical characteristic Cavitation Cavity Integrated circuit Intermetallic compound Interfacial layer Film growth X ray diffraction Reliability Crack Interconnection Wire bonding Optical microscopy Microelectronics Multiple layer Mechanical properties Rupture Contact resistance Thermal ageing
- Keyword (es)
- Característica eléctrica Cavitación Cavidad Circuito integrado Compuesto intermetálico Capa interfacial Difracción RX Fiabilidad Fisura Interconexión Unión por hilo Microscopía óptica Microelectrónica Capa múltiple Propiedad mecánica Ruptura Resistencia contacto Envejecimiento térmico
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06A Design. Technologies. Operation analysis. Testing
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 20218792
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1016/j.microrel.2007.06.008 
https://dx.doi.org/10.1016/j.microrel.2007.06.008
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