Formation of Intermetallic Compounds Between Liquid Sn and Various CuNix Metallizations
- Author
- VUORINEN, V1 ; YU, H1 ; LAURILA, T1 ; KIVILAHTI, J. K1
[1] Laboratory of Electronics Production Technology, Helsinki University of Technology, PL 3000 (Otakaari 7A), Helsinki 02015, Finland - Source
Journal of electronic materials. 2008, Vol 37, Num 6, pp 792-805, 14 p ; ref : 44 ref
- CODEN
- JECMA5
- ISSN
- 0361-5235
- Scientific domain
- Crystallography; Electronics; Metallurgy, welding; Condensed state physics
- Publisher
- Institute of Electrical and Electronics Engineers, New York, NY
- Publication country
- United States
- Document type
- Article
- Language
- English
- Author keyword
- Intermetallic formation kinetics lead-free metastable solubility phase diagram reliability soldering solidification
- Keyword (fr)
- Assemblage brasage tendre Brasage tendre Composé intermétallique Couche interfaciale Couple diffusion Cuivre alliage Diagramme phase Dépendance température Epaisseur Equilibre phase Etain alliage Etat métastable Fiabilité Microstructure Mécanisme formation Mécanisme réaction Métallisation Nickel alliage Plan expérience Réaction interface Solidification Solubilité Traitement thermique Transformation phase 6630N 8130B Brasure SnAgCu
- Keyword (en)
- Soldered joint Soldering Intermetallic compound Interfacial layer Diffusion pair Copper alloy Phase diagram Temperature dependence Thickness Phase equilibrium Tin alloy Metastable state Reliability Microstructure Formation mechanism Reaction mechanism Metallizing Nickel alloy Experimental design Interface reaction Solidification Solubility Heat treatment Phase transformation Solder
- Keyword (es)
- Junta soldada Soldeo blando Compuesto intermetálico Capa interfacial Par difusión Cobre aleación Diagrama fase Espesor Equilibrio fase Estaño aleación Estado metastable Fiabilidad Microestructura Mecanismo formacion Mecanismo reacción Metalización Níquel aleación Plan experiencia Reacción interfase Solidificación Solubilidad Tratamiento térmico Transformación fase
- Keyword (de)
- Weichloetverbindung Weichloeten Intermetallische Verbindung Diffusionspaar Kupferlegierung Phasendiagramm Dicke Zinnlegierung Zuverlaessigkeit Mikrogefuege Nickellegierung Erstarren Loeslichkeit Waermebehandlung Phasenumwandlung
- Classification
- Pascal
- 001 Exact sciences and technology / 001B Physics / 001B60 Condensed matter: structure, mechanical and thermal properties / 001B60F Transport properties of condensed matter (nonelectronic) / 001B60F30 Diffusion in solids / 001B60F30N Chemical interdiffusion; diffusion barriers
- Pascal
- 001 Exact sciences and technology / 001B Physics / 001B80 Cross-disciplinary physics: materials science; rheology / 001B80A Materials science / 001B80A30 Phase diagrams and microstructures developed by solidification and solid-solid phase transformations / 001B80A30B Phase diagrams of metals and alloys
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03C Materials
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D11 Metals. Metallurgy / 001D11D Joining, thermal cutting: metallurgical aspects / 001D11D02 Brazing. Soldering
- Discipline
- Electronics Metals. Metallurgy Physics and materials science Physics of condensed state : structure, mechanical and thermal properties
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 20338113
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1007/s11664-008-0411-x 
https://dx.doi.org/10.1007/s11664-008-0411-x
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