A parametric study of phase change material (PCM)-based heat sinks
- Author
- WANG, Xiang-Qi1 ; YAP, Christopher1 ; MUJUMDAR, Arun S1
[1] Department of Mechanical Engineering, National University of Singapore, 10 Kent Ridge Crescent, Singapore, 119260, Singapore - Source
International journal of thermal sciences. 2008, Vol 47, Num 8, pp 1055-1068, 14 p ; ref : 41 ref
- Publisher
- Elsevier, Paris
- Publication country
- France
- Document type
- Article
- Language
- English
- Author keyword
- Electronic cooling Heat sink Phase change material
- Keyword (fr)
- Champ température Composant électronique Dissipateur thermique Distribution vitesse Matériau PCM Modélisation Performance Simulation numérique Système refroidissement Transfert chaleur
- Keyword (en)
- Temperature distribution Electronic component Heat sink Velocity distribution PCM material Modeling Performance Numerical simulation Cooling system Heat transfer
- Keyword (es)
- Campo temperatura Componente electrónico Disipador térmico Distribución velocidad Material PCM Modelización Rendimiento Simulación numérica Sistema enfriamiento Transferencia térmica
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06A Design. Technologies. Operation analysis. Testing
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 20390776
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1016/j.ijthermalsci.2007.07.016 
https://dx.doi.org/10.1016/j.ijthermalsci.2007.07.016
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