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A parametric study of laser induced ablation-oxidation on porous silicon surfaces

Author
DE STEFANO, Luca1 ; REA, Ilaria1 2 ; NIGRO, M. Arcangela1 ; DELLA CORTE, Francesco G1 ; RENDINA, Ivo1
[1] National Council of Research-Institute for Microelectronic and Microsystems-Department of Naples, Via P Castellino 111, 80131 Naples, Italy
[2] Department of Physics-'Federico II', University of Naples, Via Cinthia, 80126 Naples, Italy
Source

Journal of physics. Condensed matter (Print). 2008, Vol 20, Num 26 ; 265009.1-265009.5 ; ref : 25 ref

CODEN
JCOMEL
ISSN
0953-8984
Scientific domain
Crystallography; Metallurgy, welding; Condensed state physics
Publisher
Institute of Physics, Bristol
Publication country
United Kingdom
Document type
Article
Language
English
Keyword (fr)
Ellipsométrie spectroscopique Epaisseur Matériau poreux Méthode non destructive Méthode optique Méthode paramétrique Oxydation Porosité Silicium Spectre IR Spectre transformée Fourier Traitement par laser Traitement surface Variation angulaire Si
Keyword (en)
Spectroscopic ellipsometry Thickness Porous materials Non destructive method Optical method Parametric method Oxidation Porosity Silicon Infrared spectra Fourier transform spectra Laser assisted processing Surface treatments Angular variation
Keyword (es)
Elipsometría espectroscópica Método no destructivo Método óptico Método paramétrico Variación angular
Classification
Pascal
001 Exact sciences and technology / 001B Physics / 001B80 Cross-disciplinary physics: materials science; rheology / 001B80A Materials science / 001B80A65 Surface treatments

Discipline
Physics and materials science
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
20466929

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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