A study of thermo-mechanical stress and its impact on through-silicon vias
- Author
- RANGANATHAN, N1 2 ; PRASAD, K3 ; BALASUBRAMANIAN, N1 ; PEY, K. L2
[1] Institute of Microelectronics, A*STAR (Agency for Science, Technology and Research), 11 Science Park Road, Singapore Science Park II, 117685 Singapore, Singapore
[2] Division of Microelectronics, School of Electrical & Electronic Engineering, Nanyang Technological University, 639798 Singapore, Singapore
[3] Department of Electrical & Electronic Engineering, Auckland University of Technology, Private Bag 92006, Auckland 1142, New Zealand - Source
Journal of micromechanics and microengineering (Print). 2008, Vol 18, Num 7 ; 075018.1-075018.13 ; ref : 26 ref
- ISSN
- 0960-1317
- Scientific domain
- Electronics; Mechanical engineering
- Publisher
- Institute of Physics, Bristol
- Publication country
- United Kingdom
- Document type
- Article
- Language
- English
- Keyword (fr)
- Connexion électrique Contrainte thermique Courant fuite Dispositif microélectromécanique Encapsulation Etude expérimentale Perte diélectrique Propriété thermomécanique Rugosité Silicium Surface rugueuse Transducteur interdigital Trou interconnexion
- Keyword (en)
- Electrical connection Thermal stresses Leakage currents Microelectromechanical device Encapsulation Experimental study Dielectric losses Thermomechanical properties Roughness Silicon Rough surfaces Interdigital transducers Via hole
- Keyword (es)
- Conexión eléctrica Dispositivo microelectromecánico Propriedad termomecánica Agujero interconexión
- Classification
- Pascal
- 001 Exact sciences and technology / 001B Physics / 001B00 General / 001B00G Instruments, apparatus, components and techniques common to several branches of physics and astronomy / 001B00G10 Mechanical instruments, equipment and techniques / 001B00G10C Micromechanical devices and systems
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D12 Mechanical engineering. Machine design / 001D12I Precision engineering, watch making
- Discipline
- Mechanical engineering. Mechanical construction. Handling Metrology
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 20501422
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1088/0960-1317/18/7/075018 
https://dx.doi.org/10.1088/0960-1317/18/7/075018
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