Simulation of transient thermal states in layered electronic microstructures
- Author
- KALITA, Włodzimierz1 ; KLEPACKI, Dariusz1 ; WEGLARSKI, Mariusz1
[1] Department of Electronic and Communications Systems, Rzeszów University of Technology, W. Pola 2, 35-959 Rzeszów, Poland - Source
Microelectronics and reliability. 2008, Vol 48, Num 7, pp 1021-1026, 6 p ; ref : 18 ref
- CODEN
- MCRLAS
- ISSN
- 0026-2714
- Scientific domain
- Electronics
- Publisher
- Elsevier, Oxford
- Publication country
- United Kingdom
- Document type
- Article
- Language
- English
- Keyword (fr)
- Circuit intégré Circuit microélectronique Comportement thermique Couche active Céramique électronique Dispositif couche épaisse Effet température Fiabilité Fonction mathématique Impulsion électrique Matériau photosensible Microcircuit Microstructure Polymère Propriété thermophysique Source chaleur
- Keyword (en)
- Integrated circuit Microelectronic circuits Thermal behavior Active layer Electroceramics Thick film device Temperature effect Reliability Mathematical function Electric pulse Photosensitive material Microcircuit Microstructure Polymer Thermophysical properties Heat source
- Keyword (es)
- Circuito integrado Comportamiento térmico Capa activa Cerámica electrónica Dispositivo capa espesa Efecto temperatura Fiabilidad Función matemática Impulso eléctrico Material fotosensible Microcircuito Microestructura Polímero Propiedad termofísica Fuente calor
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03C Materials
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06A Design. Technologies. Operation analysis. Testing
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 20608221
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1016/j.microrel.2008.03.019 
https://dx.doi.org/10.1016/j.microrel.2008.03.019
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