Tensile tests of micro anchors anodically bonded between Pyrex glass and aluminum thin film coated on silicon wafer
- Author
- HU, Yu-Qun1 ; ZHAO, Ya-Pu1 ; TONGXI YU2
[1] State Key Laboratory of Nonlinear Mechanics (LNM), Institute of Mechanics, Chinese Academy of Sciences, Beijing 100190, China
[2] Department of Mechanical Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong-Kong - Source
Microelectronics and reliability. 2008, Vol 48, Num 10, pp 1720-1723, 4 p ; ref : 21 ref
- CODEN
- MCRLAS
- ISSN
- 0026-2714
- Scientific domain
- Electronics
- Publisher
- Elsevier, Oxford
- Publication country
- United Kingdom
- Document type
- Article
- Language
- English
- Keyword (fr)
- Basse tension Couche mince Dispositif microélectromécanique Dispositif nanoélectromécanique Dispositif électromécanique Effet dimensionnel Matériau revêtu Micromachine Pastille électronique Résistance traction
- Keyword (en)
- Low voltage Thin film Microelectromechanical device Nanoelectromechanical device Electromechanical device Size effect Coated material Micromachine Wafer Tensile strength
- Keyword (es)
- Baja tensión Capa fina Dispositivo microelectromecánico Dispositivo nanoelectromecánico Dispositivo electromecánico Efecto dimensional Material revestido Micromáquina Pastilla electrónica Resistencia tracción
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F21 Micro- and nanoelectromechanical devices (mems/nems)
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 20680201
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1016/j.microrel.2008.04.016 
https://dx.doi.org/10.1016/j.microrel.2008.04.016
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