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Effect of Temperature-Pressure Cycles on Structural Properties of Epoxy-Based Composites for Printed Circuit Boards Applications

Author
FERNANDES, Elizabeth G1 ; TRAMIDI, Cristiano1 ; DI GREGORIO, Giordano M2 ; ANGELONI, Giacomo2 ; CHIELLINI, Emo1
[1] Department of Chemistry and Industrial Chemistry, University of Pisa, via Risorgimento, 35-56126 Pisa, Italy
[2] SOMACIS SpA., R&D Department, via Jesina, 17-60022 Castelfidardo, Italy
Source

Journal of applied polymer science (Print). 2008, Vol 110, Num 3, pp 1606-1612, 7 p ; ref : 20 ref

CODEN
JAPNAB
ISSN
0021-8995
Scientific domain
Polymers, paint and wood industries
Publisher
Wiley, Hoboken, NJ
Publication country
United States
Document type
Article
Language
English
Author keyword
curing of polymers laminates photoacoustic infrared spectroscopy polymer matrix composites thermal properties
Keyword (fr)
Bismaléimide résine Durcissement (matière plastique) Effet pression Epoxyde résine Etude expérimentale Fibre minérale Fibre verre Matériau composite Matériau renforcé fibre Mélange polymère Propriété thermique Relation mise en oeuvre propriété Relation mise en oeuvre structure Spectrométrie FTIR Spectrométrie photoacoustique Stabilité thermique Stratifié Traitement thermique Effet épaisseur
Keyword (en)
Bismaleimide resin Curing (plastics) Pressure effect Epoxy resin Experimental study Mineral fiber Glass fiber Composite material Fiber reinforced material Polymer blends Thermal properties Property processing relationship Structure processing relationship Fourier-transformed infrared spectrometry Photoacoustic spectroscopy Thermal stability Laminate Heat treatment
Keyword (es)
Bismaleimida resina Endurecimiento (material plástico) Efecto presión Epóxido resina Estudio experimental Fibra inorgánica Fibra vidrio Material compuesto Material reforzado fibra Propiedad térmica Relación puesta en marcha propiedad Relación puesta en marcha estructura Espectrometría FTIR Estabilidad térmica Estratificado Tratamiento térmico
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F17 Microelectronic fabrication (materials and surfaces technology)

Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D10 Polymer industry, paints, wood / 001D10A Technology of polymers / 001D10A08 Application fields

Discipline
Electronics Polymer industry, paints, wood
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
20703461

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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