3-D Hyperintegration and Packaging Technologies for Micro-Nano Systems : These technologies stack and interconnect materials and components to achieve high density, small size, low weight, reduced power, and very low cost
- Author
- LU, Jian-Qiang1
[1] Department of Electrical, Computer, and Systems Engineering and Center for Integrated Electronics, Rensselaer Polytechnic Institute, Troy, NY 12180, United States - Issue title
- 3-D Integration Technologies
- Author (monograph)
- CAMPARDO, G (Editor); RIPAMONTI, G (Editor); MICHELONI, R (Editor)
[1] Card Business Unit, Numonyx NAND Flash Group, International - Source
Proceedings of the IEEE. 2009, Vol 97, Num 1, pp 18-30, 13 p ; ref : 93 ref
- CODEN
- IEEPAD
- ISSN
- 0018-9219
- Scientific domain
- Computer science
- Publisher
- Institute of Electrical and Electronics Engineers, New York, NY
- Publication country
- United States
- Document type
- Article
- Language
- English
- Author keyword
- 3-D packaging Hyperintegration InfoTech-NanoTech-BioTech systems three-dimensional (3-D) integration through silicon via wafer alignment wafer bonding
- Keyword (fr)
- Appareil portatif Article synthèse Circuit intégré Conception assistée Conception circuit Densité élevée Diminution coût Dispositif à mémoire Electronique faible puissance Fabrication microélectronique Fixation pastille Haute performance Interconnexion Micromachine Modèle 3 dimensions Multifonctionnalité Nanotechnologie Packaging électronique Pastille électronique Prototype Structure 3 dimensions Système intégré
- Keyword (en)
- Portable equipment Review Integrated circuit Computer aided design Circuit design High density Cost lowering Memory devices Low-power electronics Microelectronic fabrication Wafer bonding High performance Interconnection Micromachine Three dimensional model Multifunctionality Nanotechnology Electronic packaging Wafer Prototype Three dimensional structure Integrated system
- Keyword (es)
- Aparato portátil Artículo síntesis Circuito integrado Concepción asistida Diseño circuito Densidad elevada Reducción costes Fabricación microeléctrica Fijación pastilla Alto rendimiento Interconexión Micromáquina Modelo 3 dimensiones Multifuncionalidad Nanotecnología Packaging electrónico Pastilla electrónica Prototipo Estructura 3 dimensiones Sistema integrado
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06A Design. Technologies. Operation analysis. Testing
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F17 Microelectronic fabrication (materials and surfaces technology)
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03I Storage and reproduction of information / 001D03I02 Magnetic and optical mass memories
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 21244860
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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