3-D Stacked Package Technology and Trends : Developed for mobile equipment, packages of stacked logic and memory devices continue to improve and new variations are being developed to meet future needs
- Author
- CARSON, Flynn P1 ; YOUNG CHEOL KIM2 ; IN SANG YOON2
[1] STATS ChipPAC, Inc, Fremont, CA 94358, United States
[2] STATS ChipPAC Korea Ltd, Kyoungki-do, 46789, Korea, Republic of - Issue title
- 3-D Integration Technologies
- Author (monograph)
- CAMPARDO, G (Editor); RIPAMONTI, G (Editor); MICHELONI, R (Editor)
[1] Card Business Unit, Numonyx NAND Flash Group, International - Source
Proceedings of the IEEE. 2009, Vol 97, Num 1, pp 31-42, 12 p ; ref : 14 ref
- CODEN
- IEEPAD
- ISSN
- 0018-9219
- Scientific domain
- Computer science
- Publisher
- Institute of Electrical and Electronics Engineers, New York, NY
- Publication country
- United States
- Document type
- Article
- Language
- English
- Author keyword
- Package-in-package package-on-package semiconductor device packaging three-dimensional packaging
- Keyword (fr)
- Appareil portatif Application spatiale Assemblage brasage tendre Assemblage circuit intégré Dispositif logique Dispositif semiconducteur Dispositif à mémoire Empilement Modèle 3 dimensions Packaging électronique Radiocommunication service mobile Technologie BGA Téléphone portable
- Keyword (en)
- Portable equipment Space application Soldered joint Integrated circuit bonding Logic devices Semiconductor device Memory devices Stacking Three dimensional model Electronic packaging Mobile radiocommunication BGA technology Mobile phone
- Keyword (es)
- Aparato portátil Aplicación espacial Junta soldada Dispositivo semiconductor Apilamiento Modelo 3 dimensiones Packaging electrónico Radiocomunicación servicio móvil Tecnología BGA Teléfono móvil
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06A Design. Technologies. Operation analysis. Testing
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03I Storage and reproduction of information / 001D03I02 Magnetic and optical mass memories
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 21244861
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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