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Polarity effect of electromigration on intermetallic compound formation in SnPb solder joints

Author
LU, Yu-Dong1 2 ; HE, Xiao-Qi2 ; EN, Yun-Fei2 ; XIN WANG1 ; ZHUANG, Zhi-Qiang1
[1] Key Laboratory of Specially Functional Materials, College of Materials Science and Engineering, South China University of Technology, Guangzhou 510640, China
[2] National Key Laboratory for Reliability Physics and Its Application Technology of Electrical Component, The 5th Electronics Research Institute of the Ministry of Information Industry, Guangzhou 510610, China
Source

Acta materialia. 2009, Vol 57, Num 8, pp 2560-2566, 7 p ; ref : 20 ref

ISSN
1359-6454
Scientific domain
Metallurgy, welding; Condensed state physics
Publisher
Elsevier, Kidlington
Publication country
United Kingdom
Document type
Article
Language
English
Author keyword
BGA Electromigration Intermetallic SnPb Solder joint
Keyword (fr)
Assemblage brasage tendre Brasage tendre Composé intermétallique Produit apport brasage tendre
Keyword (en)
Soldered joint Soldering Intermetallic compound Solder
Keyword (es)
Junta soldada Soldeo blando Compuesto intermetálico Producto aportación soldadura blanda
Keyword (de)
Weichloetverbindung Weichloeten Intermetallische Verbindung Weichlot
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D11 Metals. Metallurgy / 001D11A General

Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D11 Metals. Metallurgy / 001D11D Joining, thermal cutting: metallurgical aspects / 001D11D02 Brazing. Soldering

Discipline
Metals. Metallurgy
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
21425301

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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