Polarity effect of electromigration on intermetallic compound formation in SnPb solder joints
- Author
- LU, Yu-Dong1 2 ; HE, Xiao-Qi2 ; EN, Yun-Fei2 ; XIN WANG1 ; ZHUANG, Zhi-Qiang1
[1] Key Laboratory of Specially Functional Materials, College of Materials Science and Engineering, South China University of Technology, Guangzhou 510640, China
[2] National Key Laboratory for Reliability Physics and Its Application Technology of Electrical Component, The 5th Electronics Research Institute of the Ministry of Information Industry, Guangzhou 510610, China - Source
Acta materialia. 2009, Vol 57, Num 8, pp 2560-2566, 7 p ; ref : 20 ref
- ISSN
- 1359-6454
- Scientific domain
- Metallurgy, welding; Condensed state physics
- Publisher
- Elsevier, Kidlington
- Publication country
- United Kingdom
- Document type
- Article
- Language
- English
- Author keyword
- BGA Electromigration Intermetallic SnPb Solder joint
- Keyword (fr)
- Assemblage brasage tendre Brasage tendre Composé intermétallique Produit apport brasage tendre
- Keyword (en)
- Soldered joint Soldering Intermetallic compound Solder
- Keyword (es)
- Junta soldada Soldeo blando Compuesto intermetálico Producto aportación soldadura blanda
- Keyword (de)
- Weichloetverbindung Weichloeten Intermetallische Verbindung Weichlot
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D11 Metals. Metallurgy / 001D11A General
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D11 Metals. Metallurgy / 001D11D Joining, thermal cutting: metallurgical aspects / 001D11D02 Brazing. Soldering
- Discipline
- Metals. Metallurgy
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 21425301
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1016/j.actamat.2009.02.015 
https://dx.doi.org/10.1016/j.actamat.2009.02.015
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