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Effect of fabrication atmosphere on dielectric properties of SiC/SiC composites

Author
YU, Xin-Min1 ; ZHOU, Wan-Cheng1 ; FA LUO1 ; ZHENG, Wen-Jing1 ; ZHU, Dong-Mei1
[1] State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Shaanxi, Xi'an 710072, China
Source

Journal of alloys and compounds. 2009, Vol 479, Num 1-2 ; L1-L3 ; ref : 25 ref

ISSN
0925-8388
Scientific domain
Inorganic chemistry; Crystallography; Metallurgy, welding; Condensed state physics
Publisher
Elsevier, Kidlington
Publication country
United Kingdom
Document type
Article
Language
English
Author keyword
Ceramics Crystal structure Dielectric response Vapor deposition X-ray diffraction
Keyword (fr)
Atmosphère contrôlée Carbure de silicium Constante diélectrique Diffraction RX Dépôt chimique phase vapeur Facteur dissipation Matériau composite Matériau renforcé fibre Propriété diélectrique Relation fabrication propriété Stoechiométrie
Keyword (en)
Controlled atmospheres Silicon carbide Permittivity XRD CVD Dissipation factor Composite materials Fiber reinforced material Dielectric properties Fabrication property relation Stoichiometry
Keyword (es)
Silicio carburo Material reforzado fibra Relación fabricación propiedad
Classification
Pascal
001 Exact sciences and technology / 001B Physics / 001B70 Condensed matter: electronic structure, electrical, magnetic, and optical properties / 001B70G Dielectrics, piezoelectrics, and ferroelectrics and their properties / 001B70G22 Dielectric properties of solids and liquids / 001B70G22C Permittivity (dielectric function)

Discipline
Physics of condensed state : electronic structure, electrical, magnetic and optical properties
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
21533272

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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