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Usure des polymèries :Aspects thermiques et applications

Other title
Wear of polymers : Thermal aspects and applications (en)
Author
FELDER, Eric1
[1] Mines de Paris FRANCE, France
Source

Techniques de l'ingénieur. Plastiques et composites. 2005, Vol AM1, Num AM3136 ; AM3136.1-AM3136.14 ; ref : 21 ref

ISSN
1762-8776
Scientific domain
Polymers, paint and wood industries
Publisher
Techniques de l'ingénieur, Paris
Publication country
France
Document type
Article
Language
French
Keyword (fr)
Effet température Etat actuel Ethylène(tétrafluoro) polymère Matériau composite Matériau renforcé fibre Modélisation Polymère Propriété mécanique Résistance usure Tribologie Usure abrasive Usure glissement
Keyword (en)
Temperature effect State of the art Tetrafluoroethylene polymer Composite material Fiber reinforced material Modeling Polymer Mechanical properties Wear resistance Tribology Abrasive wear Sliding wear
Keyword (es)
Efecto temperatura Estado actual Etileno(tetrafluoro) polímero Material compuesto Material reforzado fibra Modelización Polímero Propiedad mecánica Resistencia al desgaste Tribología Desgaste abrasivo Desgaste deslizamiento
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D09 Physicochemistry of polymers / 001D09D Organic polymers / 001D09D04 Properties and characterization / 001D09D04B Mechanical properties

Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D10 Polymer industry, paints, wood / 001D10A Technology of polymers / 001D10A06 Forms of application and semi-finished materials / 001D10A06H Composites

Discipline
Physical chemistry of polymers Polymer industry, paints, wood
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
21782528

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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